TDA8946AJ/N2,112 NXP Semiconductors, TDA8946AJ/N2,112 Datasheet - Page 15

• Manufacturer Part Number: TDA8946AJ/N2,112
• Description: IC AMP AUDIO PWR 15W STER 17SIL
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8946AJ/N2,112

• Output Type: 2-Channel (Stereo)
• Package / Case: 17-SIL (Bent and Staggered Leads)
• Max Output Power X Channels @ Load: 15W x 2 @ 8 Ohm
• Voltage - Supply: 4.5 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-AB
• Output Power: 15 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.07 %
• Operating Supply Voltage: 18 V
• Maximum Power Dissipation: 28000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3456-5; 935270283112; TDA8946AJU

Philips Semiconductors
9397 750 09434
Product data
Fig 16. Printed-circuit board layout (single-sided); components view.
14.1.2 Power supply decoupling
14.2 Thermal behaviour and heatsink calculation
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor location should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR - typical 100 nF - has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor - e.g. 1000 F or greater - must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
The measured maximum thermal resistance of the IC package, R
A calculation for the heatsink can be made, with the following parameters:
T
V
T
R
including the heatsink. In the heatsink calculations the value of R
amb
j(max)
CC
th(tot)
220
nF
= 18 V and R
220 nF
= 50 C
= 150 C
is the total thermal resistance between the junction and the ambient
1
4
4
OUT1
OUT1
1
OUT2
Rev. 01 — 01 March 2002
4.7
4.7
nF
nF
OUT2
L
= 8
220 nF
220 nF
220 nF
4
4
220 nF
100 nF
2 x 15 W BTL audio amplifier with DC gain control
10 F
IN2
IN2
IN1
IN1
1000 F
MODE
SVR
GC
SGND
V CC
GND
ON
MGW628
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
TDA8946AJ
th(j-mb)
th(mb-h)
is 2.5 K/W.
is ignored.
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