TDA8946AJ/N2,112 NXP Semiconductors, TDA8946AJ/N2,112 Datasheet - Page 18

• Manufacturer Part Number: TDA8946AJ/N2,112
• Description: IC AMP AUDIO PWR 15W STER 17SIL
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8946AJ/N2,112

• Output Type: 2-Channel (Stereo)
• Package / Case: 17-SIL (Bent and Staggered Leads)
• Max Output Power X Channels @ Load: 15W x 2 @ 8 Ohm
• Voltage - Supply: 4.5 V ~ 18 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-AB
• Output Power: 15 W
• Available Set Gain: 30 dB
• Thd Plus Noise: 0.07 %
• Operating Supply Voltage: 18 V
• Maximum Power Dissipation: 28000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3456-5; 935270283112; TDA8946AJU

Philips Semiconductors
17. Soldering
18. Revision history
Table 11:
9397 750 09434
Product data
Rev Date
01
20020301
Revision history
CPCN
-
17.1 Introduction to soldering through-hole mount packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
The maximum permissible temperature of the solder is 260 C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400 C, contact may be up to 5 seconds.
Table 10:
[1]
Package
DBS, DIP, HDIP, SDIP, SIL
Description
Product data (9397 750 09434)
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Suitability of through-hole mount IC packages for dipping and wave
soldering methods
Rev. 01 — 01 March 2002
2 x 15 W BTL audio amplifier with DC gain control
Soldering method
Dipping
suitable
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
TDA8946AJ
Wave
suitable
[1]
stg(max)
18 of 20
).