HFA1145IBZ Intersil, HFA1145IBZ Datasheet - Page 12

• Manufacturer Part Number: HFA1145IBZ
• Description: IC OPAMP CFA 330MHZ LP 8-SOIC
• Manufacturer: Intersil

Specifications of HFA1145IBZ

• Applications: Current Feedback
• Number Of Circuits: 1
• -3db Bandwidth: 330MHz
• Slew Rate: 2100 V/µs
• Current - Supply: 5.8mA
• Current - Output / Channel: 60mA
• Voltage - Supply, Single/dual (±): 9 V ~ 11 V, ±4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
59 mils x 59 mils x 19 mils
1500μm x 1500μm x 483μm
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8k
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16k
NOTE: This pad is not bonded out on packaged units. Die users may set a GND reference, via this pad, to ensure the TTL compatibility
of the DIS input when using asymmetrical supplies (e.g. V+ = 10V, V- = 0V). See the “Application Information” section for details.
-IN
+IN
Å
Å
±0.4k
±0.8k
12
Å
Å
HFA1145
V-
HFA1145
OPTIONAL GND (NOTE)
PASSIVATION:
TRANSISTOR COUNT:
SUBSTRATE POTENTIAL (Powered Up):
Type: Nitride
Thickness: 4k
75
Floating (Recommend Connection to V-)
Å
±0.5k
Å
OUT
DISABLE
V+
June 1, 2006
FN3955.5