AD9634 Analog Devices, AD9634 Datasheet - Page 9

• Manufacturer Part Number: AD9634
• Description: 12-Bit, 170 MSPS/210 MSPS/250 MSPS, 1.8 V Analog-to-Digital Converter
• Manufacturer: Analog Devices

Specifications of AD9634

• Resolution (bits): 12bit
• # Chan: 1
• Sample Rate: 250MSPS
• Interface: LVDS
• Analog Input Type: Diff-Uni
• Ain Range: 1.75 V p-p
• Adc Architecture: Pipelined
• Pkg Type: CSP

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DRVDD to AGND
VIN+, VIN− to AGND
CLK+, CLK− to AGND
VCM to AGND
CSB to AGND
SCLK to AGND
SDIO to AGND
DCO+/DCO− to AGND
OR+/OR− to AGND
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
D0±/D1± through D10±/D11±
(Ambient)
Under Bias
(Ambient)
to AGND
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +125°C
Rev. 0 | Page 9 of 32
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for the
LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
32-Lead LFCSP
1
2
3
4
Typical θ
As shown in Table 7, airflow increases heat dissipation, which
reduces θ
leads from metal traces, through holes, ground, and power
planes reduces the θ
ESD CAUTION
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
5 mm × 5 mm
(CP-32-12)
JA
JA
. In addition, metal in direct contact with the package
is specified for a 4-layer PCB with solid ground plane.
Airflow
Velocity
(m/sec)
0
1.0
2.0
JA
.
θ
37.1
32.4
29.1
JA
1, 2
θ
3.1
JC
1, 3
θ
20.7
JB
AD9634
1, 4
Unit
°C/W
°C/W
°C/W