IP5002CX8/LF,135 NXP Semiconductors, IP5002CX8/LF,135 Datasheet - Page 50

• Manufacturer Part Number: IP5002CX8/LF,135
• Description: IC MIC SGL-QUASI-DIFF NTWK 8CSP
• Manufacturer: NXP Semiconductors
• Type: Microphone Channelr

Specifications of IP5002CX8/LF,135

• Applications: Microphone
• Mounting Type: Surface Mount
• Package / Case: 8-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934058318135

98
Minimized outline drawings and refl ow soldering footprint
3-Pin SMD Packages
Dimensions in mm
SOD131/2/3 (SMA/B/C)
SOT323 (SC-70)
SOT89 (SC-62)
SOT23
SOD131 (SMA)
2.35
(3×)
0.6
3
1.7
4.6
0.55
(3×)
0.85
0.7
(3×)
1.2
3
0.2
(3×)
1
2.65
1.85
1.325
2
1
SOT323 (SC-70)
SOD132 (SMB)
3.3
2.9
1.9
0.5
(3×)
0.6
(3×)
SOT89 (SC-62)
4.75
2.25
3.95
1
1.9
1.2
2
1.5
SOT23
0.5
(3×)
0.6
(3×)
0.7
(3×)
1.7
1.1
(2×)
1.3
0.5
0.6
(3×)
4.85
2
Dimensions in mm
Dimensions in mm
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
solder lands
solder resist
solder paste
occupied area
SOD133 (SMC)
solder lands
solder resist
solder paste
occupied area
sot323_fr
Minimized outline drawings and refl ow soldering footprint
Dimensions in mm
1.05
0.95
0.3
0.2
0.35
0.25
SOT883 (SC-101)
SOT416 (SC-75)
1
SOT1061
SOT663
1.3
1.6
1.4
2.1
1.9
3
2
1.1
0.9
0.45
0.35
2.1
1.9
0.65
max
0.85
2
0.8
0.6
(3×)
0.5
(3×)
0.55
(3×)
0.90
R = 0.05 (12
2.3
0.20
2.2
1.3
2.45
1.65
1.9
1.6
1.05
0.35
(2×
0.25
(2×
1.7
solder lands
solder paste
0.6
SOT883 (SC-101)
SOT416 (SC-75)
0.55
solder paste = solder lands
solder resist
0.30
(2×)
0.40
(2×)
0.50
(2×)
SOT1061
SOT663
1
1.30
0.30
solder resist
occupied area
0.5
(3×)
(3×)
occupied area
0.5
2.1
1.3
0.4
0.5
1.6
1.7
1
0.55
(3×)
0.30
0.40
0.50
0.5 (2×)
0.4 (2×)
2
(3×)
0.6
Dimensions in mm
0.5 (2×)
sot1061_fr
0.25
R = 0.05 (12×)
0.25
0.60 0.70 0.80
0.25
0.6 (2×)
1.1
Dimensions in mm
Dimensions in mm
1.2
solder lands
placement area
solder paste
occupied area
solder lands
solder resist
solder paste
occupied area
99