IP5002CX8/LF,135 NXP Semiconductors, IP5002CX8/LF,135 Datasheet - Page 52

• Manufacturer Part Number: IP5002CX8/LF,135
• Description: IC MIC SGL-QUASI-DIFF NTWK 8CSP
• Manufacturer: NXP Semiconductors
• Type: Microphone Channelr

Specifications of IP5002CX8/LF,135

• Applications: Microphone
• Mounting Type: Surface Mount
• Package / Case: 8-CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934058318135

102
Minimized outline drawings and refl ow soldering footprint
Multi-Pin SMD Packages
Dimensions in mm
SOT886 (XSON6)
SOT891 (XSON6)
SOT108 (SO14)
SOT96 (SO8)
DIMENSIONS in mm
1.270
P1
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
1.320
P2
7.400
Ay
solder land
occupied area
3.900
By
1.750
C
0.700
D1
1.4
0.370
0.270
0.800
(6×)
(6×)
D2
0.7
8.770
Gx
solder lands
occupied area
0.15
(6×)
5.200
0.325
Gy
(6×)
0.25
(6×)
11.900
Hx
1.250
0.675
7.650
Hy
1.05
SOT886 (XSON6)
SOT891 (XSON6)
0.425
SOT108 (SO14)
(6×)
0.35
SOT96 (SO8)
0.500
0.500
Hy
(6×)
1.700
0.5
Gy
C
5.50
0.60 (8×)
(6×)
0.6
P2
D2 (4x)
1.27 (6×)
1.30
4.00
solder resist
solder paste = solderland
occupied area
6.60
7.00
solder resist
solder land plus
solder paste
occupied area
P1
Hx
Gx
(0.125)
D1
(0.125)
By
Ay
Minimized outline drawings and refl ow soldering footprint
Dimensions in mm
DIMENSIONS (mm are the original dimensions)
DIMENSIONS (mm are the original dimensions)
UNIT
UNIT
mm
mm
Z
14
1
max.
max.
A
2
A
1.2
0.15
0.05
A
0.21
0.05
1
A
pin 1 index
pin 1 index
e
1
1
e
A
1.05
0.95
1.80
1.65
A
2
2
A
0.25
0.25
b
A
SOT337 (SSOP14)
p
3
3
b
0.27
0.17
SOT109 (SO16)
SOT163 (SO20)
b
b
0.38
0.25
p
p
p
8
7
0.18
0.12
c
0.20
0.09
c
w
D
10.1
9.9
(1)
M
SOT357
D
6.4
6.0
0
(1)
10.1
E
9.9
(1)
E
5.4
5.2
0
(1)
e
w
p
0.5
e
scale
M
v
2.5
0.65
v
M
scale
e
2.5
12.15
11.85
M
H
B
D
A
E
A
H
7.9
7.6
12.15
11.85
E
H
H
E
E
A
2
5 mm
5 mm
1.25
L
A
A
L
1
1
A
1.03
0.63
L
2
0.75
0.45
p
L
A
p
1
0.9
0.7
0.2
Q
v
detail X
0.08
v
0.2
w
detail X
L
L
0.1
p
0.13
y
Q
w
Z
D
1.45
1.05
(A )
(A )
(A )
0.1
y
(1)
3
3
L
Z
1.45
1.05
L
E
p
Z
1.4
0.9
(1)
θ
(1)
(A )
(A )
(A )
A
3
3
7
0
θ
o
o
θ
8
0
o
o
θ
DIMENSIONS in mm
1.270
P1
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
Generic footprint pattern.
Refer to the package outline
drawing for actual layout.
1.320
DIMENSIONS in mm
P2
0.650
DIMENSIONS in mm
P1
0.500
P1
0.750
7.400
0.560
solder land
occupied area
Ay
P2
P2
0
0
0
0
0
0
0
0
13.300
13.300
8.600
solder land
occupied area
Ax
solder land
occupied area
Ay
3.900
By
13.300
13.300
Ay
5.400
By
1.750
10.300
10.300 10.300
C
Bx
1.600
C
10.300
By
0.700
D1
0.400
D1
1.500
C
0.800 10.040 5.200
D2
0.600
D2
0
0
0
0
0
0
0
0
0
D1
.280
solder lands
occupied area
0.400 10.500 10.500 13.550 13.550
4.950
D2
Gx
Gx
Gx
6.100
Gy
Gy
Gy
5.800
Hx
11.900
Hx
Hx
8.850
Hy
Hy
7.650
Hy
placement accuracy ± 0.25
SOT337 (SSOP14)
SOT109 (SO16)
SOT163 (SO20)
13.40
0.60 (20×)
SOT357
Hy
Gy
C
Hy
Hy
Gy
C
1.27 (18×)
1.50
8.00
C
P2
11.00
P2
D2 (4x)
11.40
P2
D2 (8
P1
P1
Hx
Gx
Hx
Gx
P1
Hx
Gx
(0.125)
D1
(0.125)
D1
(0.125)
D1
(0.125)
Ay
(0.125)
By
Ay
103