PESD1LIN NXP Semiconductors, PESD1LIN Datasheet

PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients

PESD1LIN

Manufacturer Part Number
PESD1LIN
Description
PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
Manufacturer
NXP Semiconductors
Datasheet

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1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic
package designed to protect one automotive Local Interconnect Network (LIN) bus line
from the damage caused by ElectroStatic Discharge (ESD) and other transients.
Table 1.
T
Symbol
V
C
amb
RWM
d
PESD1LIN
LIN-bus ESD protection diode
Rev. 3 — 31 May 2011
ESD protection of one automotive LIN-bus line
Asymmetrical diode configuration ensures an optimized protection against
ElectroMagnetic Interferences (EMI) of a LIN Electronic Control Unit (ECU)
Max. peak pulse power: P
Low clamping voltage: V
Ultra low leakage current: I
ESD protection of up to 23 kV
IEC 61000-4-2, level 4 (ESD)
IEC 61000-4-5 (surge); I
AEC-Q101 qualified
LIN-bus protection
Automotive applications
= 25
C unless otherwise specified.
Quick reference data
Parameter
reverse standoff voltage
diode capacitance
PESD1LIN (15 V)
PESD1LIN (24 V)
PP
CL
PP
RM
= 40 V at I
= 3 A at t
= 160 W at t
< 1 nA
Conditions
V
f = 1 MHz
p
R
PP
= 8/20 s
= 0 V;
= 1 A
p
= 8/20 s
Min
-
-
-
Typ
-
-
13
Product data sheet
Max
15
24
17
V
V
Unit
pF

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PESD1LIN Summary of contents

Page 1

... Rev. 3 — 31 May 2011 1. Product profile 1.1 General description PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plastic package designed to protect one automotive Local Interconnect Network (LIN) bus line from the damage caused by ElectroStatic Discharge (ESD) and other transients. 1.2 Features and benefits  ...

Page 2

... Limiting values Parameter Conditions peak pulse power t peak pulse current t junction temperature ambient temperature storage temperature All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode Simplified outline Graphic symbol 1 2 Marking code AM Min = 8/20 s [ 8/20  ...

Page 3

... MIL-STD-883 (human body model) ESD standards compliance 001aaa630 ; 20 μ (μs) Fig 2. All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode Min [ Conditions > (air); > (contact) > 100 % ...

Page 4

... PESD1LIN ( RWM PESD1LIN ( RWM breakdown voltage PESD1LIN (15 V) PESD1LIN (24 V) diode capacitance MHz R clamping voltage PESD1LIN ( PESD1LIN ( differential resistance PESD1LIN ( ...

Page 5

... ATTENUATOR vertical scale = 20 V/div horizontal scale = 50 ns/div PESD1LIN (24V) PESD1LIN (15V) clamped +1 kV ESD voltage waveform (IEC 61000-4-2 network) PESD1LIN (15V) PESD1LIN (24V) vertical scale = 20 V/div horizontal scale = 50 ns/div clamped −1 kV ESD voltage waveform (IEC 61000-4-2 network) 50 Ω 006aaa166 © NXP B.V. 2011. All rights reserved. ...

Page 6

... NXP Semiconductors 7. Application information The PESD1LIN is designed for the protection of one LIN-bus signal line from the damage caused by ESD and surge pulses. The PESD1LIN provides a surge capability 160 W per line for a 8/20 s waveform. Fig 6. Circuit board layout and protection device placement Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge transients ...

Page 7

... For further information and the availability of packing methods, see PESD1LIN Product data sheet 1.35 1.15 2.7 1.8 2.3 1.6 Dimensions in mm Package outline SOD323 (SC-76) Packing methods SOD323 4 mm pitch tape and reel All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode 1.1 0.8 0.45 1 0.15 2 0.40 0.25 0.25 0.10 03-12-17 [1] Packing quantity 3000 ...

Page 8

... Reflow soldering footprint SOD323 (SC-76) 5 2.9 1.5 (2×) 1.2 (2×) Wave soldering footprint SOD323 (SC-76) All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode solder lands solder resist 0.5 (2×) 0.6 (2×) solder paste occupied area Dimensions in mm solder lands ...

Page 9

... Product data sheet Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode Change notice Supersedes - PESD1LIN v.2 - PESD1LIN v © NXP B.V. 2011. All rights reserved ...

Page 10

... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode © NXP B.V. 2011. All rights reserved ...

Page 11

... Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 May 2011 PESD1LIN LIN-bus ESD protection diode © NXP B.V. 2011. All rights reserved ...

Page 12

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com PESD1LIN All rights reserved. Date of release: 31 May 2011 Document identifier: PESD1LIN ...

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