PESD1LIN NXP Semiconductors, PESD1LIN Datasheet - Page 7

• Manufacturer Part Number: PESD1LIN
• Description: PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Package outline
10. Packing information
PESD1LIN
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description
PESD1LIN
Fig 7.
For further information and the availability of packing methods, see
Package outline SOD323 (SC-76)
Packing methods
SOD323
All information provided in this document is subject to legal disclaimers.
Dimensions in mm
Rev. 3 — 31 May 2011
2.7
2.3
4 mm pitch, 8 mm tape and reel
1.8
1.6
1.35
1.15
1
2
0.40
0.25
0.45
0.15
LIN-bus ESD protection diode
Section
1.1
0.8
0.25
0.10
[1]
03-12-17
14.
PESD1LIN
Packing quantity
3000
-115
© NXP B.V. 2011. All rights reserved.
10000
-135
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