PESD1LIN NXP Semiconductors, PESD1LIN Datasheet - Page 8

• Manufacturer Part Number: PESD1LIN
• Description: PESD1LIN in a very small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect one automotive Local Interconnect Network (LIN) bus linefrom the damage caused by ElectroStatic Discharge (ESD) and other transients
• Manufacturer: NXP Semiconductors

NXP Semiconductors
11. Soldering
PESD1LIN
Product data sheet
Fig 8.
Fig 9.
1.65
2.75
(2×)
Reflow soldering footprint SOD323 (SC-76)
Wave soldering footprint SOD323 (SC-76)
0.95
1.2
All information provided in this document is subject to legal disclaimers.
(2×)
(2×)
0.5
0.6
1.5 (2×)
Rev. 3 — 31 May 2011
3.05
2.1
2.2
2.9
5
0.5 (2×)
0.6 (2×)
LIN-bus ESD protection diode
direction during soldering
Dimensions in mm
Dimensions in mm
PESD1LIN
preferred transport
© NXP B.V. 2011. All rights reserved.
solder lands
solder resist
occupied area
solder lands
solder resist
solder paste
occupied area
sod323_fw
sod323_fr
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