PBRN113Z NXP Semiconductors, PBRN113Z Datasheet - Page 12

• Manufacturer Part Number: PBRN113Z
• Description: Pbrn113z Series Npn 800 Ma, 40 V Biss Rets; R1 = 1 Kohm, R2 = 10 Kohm
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Packing information
10. Soldering
PBRN113Z_SER_1
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
PBRN113ZK
PBRN113ZS
PBRN113ZT
Fig 18. Reflow soldering footprint SOT346 (SC-59A/TO-236)
For further information and the availability of packing methods, see
Packing methods
SOT346
SOT54
SOT54A
SOT54 variant bulk, delta pinning
SOT23
Rev. 01 — 26 February 2007
3.15
solder lands
solder paste
0.70
(3x)
Description
4 mm pitch, 8 mm tape and reel
bulk, straight leads
tape and reel, wide pitch
tape ammopack, wide pitch
4 mm pitch, 8 mm tape and reel
NPN 800 mA, 40 V BISS RETs; R1 = 1 k , R2 = 10 k
1
1.00
1.20
2.60
2.90
3.30
solder resist
occupied area
3
2
0.60 (3x)
0.70 (3x)
PBRN113Z series
1.55
Dimensions in mm
Section
0.95
0.95
[1]
3.40
13.
sot346
Packing quantity
3000
-115
-
-
-
-
-215
© NXP B.V. 2007. All rights reserved.
5000
-
-412
-
-
-112
-
10000
-135
-
-116
-126
-
-235
12 of 17