PBRN113Z NXP Semiconductors, PBRN113Z Datasheet - Page 5

• Manufacturer Part Number: PBRN113Z
• Description: Pbrn113z Series Npn 800 Ma, 40 V Biss Rets; R1 = 1 Kohm, R2 = 10 Kohm
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
PBRN113Z_SER_1
Product data sheet
Table 7.
[1]
[2]
[3]
Symbol
R
R
Fig 2. Power derating curve for SOT54 (SC-43A/TO-92)
th(j-a)
th(j-sp)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
Device mounted on a ceramic PCB, Al
FR4 PCB, standard footprint
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
thermal resistance from junction
to solder point
PBRN113ZK, PBRN113ZT
PBRN113ZS
PBRN113ZK, PBRN113ZT
(mW)
Rev. 01 — 26 February 2007
P
tot
800
600
400
200
0
75
NPN 800 mA, 40 V BISS RETs; R1 = 1 k , R2 = 10 k
25
2
O
3
, standard footprint.
25
Conditions
in free air
75
PBRN113Z series
125
T
006aaa999
amb
[1]
[2]
[3]
[1]
( C)
175
Min
-
-
-
-
-
Typ
-
-
-
-
-
© NXP B.V. 2007. All rights reserved.
Max
500
338
219
179
105
2
.
Unit
K/W
K/W
K/W
K/W
K/W
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