TDA7571 STMicroelectronics, TDA7571 Datasheet - Page 19

• Manufacturer Part Number: TDA7571
• Description: STPDACsw - Fully digital high efficiency power audio amplifier
• Manufacturer: STMicroelectronics

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TDA7571
5
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 6.
(1): "D1" and "E1" do not include mold flash or protusions
- Mold flash or protusions shall not exceed 0.15mm(0.006inch) per side
D1 (1) 13.90
E1 (1)
DIM.
A1
A2
A3
D2
E2
E3
E4
D
G
N
A
b
E
e
F
L
S
c
A
17.00
17.00
13.90
13.30
MIN.
HiQUAD-64 mechanical data and package dimensions
2.50
0.22
0.23
2.65
2.35
9.30
0.80
0
0
53
64
1
14.00
14.00
13.50
TYP.
mm
2.80
0.65
9.50
0.10
0.12
0°(min.), 7˚(max.)
MAX.
17.40
14.10
17.40
14.10
13.70
3.15
0.25
2.90
0.10
0.38
0.32
2.95
2.65
9.70
1.10
E4 (slug lenght)
10°(max.)
D1
D
0.008
0.009
0.669
0.547
0.104
0.669
0.547
0.092
0.366
0.523
0.031
MIN.
0.10
0
0
(bottom side)
A
slug
0.551
0.110
0.551
0.025
0.374
0.531
0.004
0.005
TYP.
inch
b
MAX.
0.124
0.010
0.114
0.004
0.015
0.012
0.685
0.555
0.116
0.685
0.555
0.104
0.382
0.539
0.043
N
33
⊕
21
F
M
A B
c
e
E1
E
POQU64ME
B
MECHANICAL DATA
Gauge Plane
OUTLINE AND
HiQUAD-64
0.35
A1
S
E2
L
E3
Package information
A3
BOTTOM VIEW
SEATING PLANE
COPLANARITY
G
C
E3
C
A2
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