byd31j NXP Semiconductors, byd31j Datasheet - Page 2

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byd31j

Manufacturer Part Number
byd31j
Description
Fast Soft-recovery Controlled Avalanche Rectifiers
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
FEATURES
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
1996 Sep 18
V
V
I
I
I
SYMBOL
F(AV)
FRM
FSM
Glass passivated
High maximum operating
temperature
Low leakage current
Excellent stability
Guaranteed avalanche energy
absorption capability
Available in ammo-pack.
RRM
R
Fast soft-recovery
controlled avalanche rectifiers
repetitive peak reverse voltage
continuous reverse voltage
average forward current
repetitive peak forward current
non-repetitive peak forward current
BYD31D
BYD31G
BYD31J
BYD31K
BYD31M
BYD31D
BYD31G
BYD31J
BYD31K
BYD31M
PARAMETER
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
This package is hermetically sealed
T
see Fig.2; averaged over any
20 ms period;
see also Fig.6
T
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
T
T
t = 10 ms half sine wave;
T
V
tp
amb
tp
amb
j
R
= T
= V
= 55 C; lead length = 10 mm;
= 55 C; see Fig.4
Fig.1 Simplified outline (SOD91) and symbol.
= 60 C; PCB mounting (see
= 60 C; see Fig.5
j max
RRMmax
k
2
(1)
technology.
prior to surge;
CONDITIONS
Not recommended for new designs
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
a
MIN.
BYD31 series
Product specification
MAX.
1000
1000
200
400
600
800
200
400
600
800
440
320
MAM196
4
3
5
V
V
V
V
V
V
V
V
V
V
mA
mA
A
A
A
UNIT

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