byd31j NXP Semiconductors, byd31j Datasheet - Page 4
byd31j
Manufacturer Part Number
byd31j
Description
Fast Soft-recovery Controlled Avalanche Rectifiers
Manufacturer
NXP Semiconductors
Datasheet
1.BYD31J.pdf
(9 pages)
Philips Semiconductors
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.11.
1996 Sep 18
R
R
SYMBOL
th j-tp
th j-a
Fast soft-recovery
controlled avalanche rectifiers
For more information please refer to the “General Part of associated Handbook” .
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
4
lead length = 10 mm
note 1
CONDITIONS
Not recommended for new designs
BYD31 series
Product specification
VALUE
180
250
UNIT
K/W
K/W
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