hi5960 Intersil Corporation, hi5960 Datasheet - Page 4

• Manufacturer Part Number: hi5960
• Description: 14-bit, 130msps, Commlink? High Speed D/a Converter
• Manufacturer: Intersil Corporation

Absolute Maximum Ratings
Digital Supply Voltage DV
Analog Supply Voltage AV
Grounds, ACOM TO DCOM . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
Digital Input Voltages (D9-D0, CLK, SLEEP). . . . . . . . DV
Reference Input Voltage Range. . . . . . . . . . . . . . . . . . AV
Analog Output Current (I
Operating Conditions
HI5960IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Electrical Specifications
SYSTEM PERFORMANCE
Resolution
Integral Linearity Error, INL
Differential Linearity Error, DNL
Offset Error, I
Offset Drift Coefficient
Full Scale Gain Error, FSE
Full Scale Gain Drift
Full Scale Output Current, IFS
Output Voltage Compliance Range
DYNAMIC CHARACTERISTICS
Maximum Clock Rate, f
Output Settling Time, (t
Singlet Glitch Area (Peak Glitch)
Output Rise Time
Output Fall Time
Output Capacitance
Output Noise
AC CHARACTERISTICS
+5V Power Supply
Spurious Free Dynamic Range,
SFDR Within a Window
1. θ
JA
is measured with the component mounted on an evaluation PC board in free air.
PARAMETER
OS
SETT
CLK
OUT
DD
DD
) . . . . . . . . . . . . . . . . . . . . . . . . . 24mA
)
to DCOM . . . . . . . . . . . . . . . . . +5.5V
to ACOM . . . . . . . . . . . . . . . . . +5.5V
4
AV
DD
“Best Fit” Straight Line (Note 8)
(Note 8)
(Note 8)
(Note 8)
With External Reference (Notes 2, 8)
With Internal Reference (Notes 2, 8)
With External Reference (Note 8)
With Internal Reference (Note 8)
(Note 3, 8)
(Note 3)
±0.05% (±8 LSB) (Note 8)
R
Full Scale Step
Full Scale Step
IOUTFS = 20mA
IOUTFS = 2mA
f
f
f
CLK
CLK
CLK
= DV
L
= 25Ω (Note 8)
= 100MSPS, f
= 100MSPS, f
= 50MSPS, f
DD
= +5V, V
o
DD
DD
C to 85
OUT
OUT
OUT
REF
+ 0.3V
+ 0.3V
= 5.02MHz, 8MHz Span (Notes 4, 8)
TEST CONDITIONS
= 20.2MHz, 30MHz Span (Notes 4, 8)
= 5.04MHz, 8MHz Span (Notes 4, 8)
= Internal 1.2V, IOUTFS = 20mA, T
o
C
HI5960
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
A
= 25
o
C for All Typical Values
-0.025
MIN
-0.3
130
-10
-10
14
-5
-3
2
-
-
-
-
-
-
-
-
-
-
-
-
-
±100
TYP
±2.5
±1.5
±50
0.1
2.5
2.5
±2
±1
35
10
50
30
77
97
97
5
-
-
-
-
+0.025
MAX
1.25
+10
+10
+5
+3
20
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
o
θ
C to 150
JA
FSR/
FSR/
FSR/
pA/√Hz
pA/√Hz
% FSR
% FSR
% FSR
UNITS
ppm
ppm
ppm
MHz
pV•s
(
110
LSB
LSB
Bits
dBc
dBc
dBc
mA
75
o
ns
ns
ns
pF
V
C/W)
o
ο
ο
Χ
Χ
Χ
o
o
o
C
C
C