mpc8241tzq266c Freescale Semiconductor, Inc, mpc8241tzq266c Datasheet - Page 31

• Manufacturer Part Number: mpc8241tzq266c
• Description: Mpc8241 Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8241 uses a 25 mm × 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Solder balls
Solder ball diameter
Maximum module height
Co-planarity specification
Maximum force
Package Parameters for the MPC8241
TDI, TMS
TDO
TDO
TCK
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
1.27 mm
ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts
ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag
VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
2.52 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
25 mm × 25 mm
357
0.75 mm
12
13
Input Data Valid
10
Output Data Valid
11
Package Description
31