mpc8241tzq266c Freescale Semiconductor, Inc, mpc8241tzq266c Datasheet - Page 47

• Manufacturer Part Number: mpc8241tzq266c
• Description: Mpc8241 Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

7.7
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, a heat
sink may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: heat sink, airflow, and thermal interface material. To reduce
the die-junction temperature, heat sinks can be attached to the package by several methods: adhesive,
spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see
Figure
Figure 29
Freescale Semiconductor
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28).
A heat sink is not attached to the PBGA package and a high board-level thermal loading from
adjacent components exists (label used—1s).
A heat sink is not attached to the PBGA package and a low board-level thermal loading from
adjacent components exists (label used—2s2p).
A large heat sink (cross cut extrusion, 38 × 38 × 16.5 mm) is attached to the PBGA package and a
high board-level thermal loading from adjacent components exists (label used—1s/sink).
A large heat sink (cross cut extrusion, 38 × 38 × 16.5 mm) is attached to the PBGA package and a
low board-level thermal loading from adjacent components exists (label used—2s2p/sink).
Thermal Management
depicts the die junction-to-ambient thermal resistance for four typical cases:
Figure 28. Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Interface
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Adhesive or
Material
Heat Sink
Heat Sink
Die
Clip
Printed-Circuit Board
PBGA Package
Wire
Option
System Design Information
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