is42vs16100d Integrated Silicon Solution, Inc., is42vs16100d Datasheet

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is42vs16100d

Manufacturer Part Number
is42vs16100d
Description
512k Words X 16 Bits X 2 Banks 16-mbit Synchronous Dynamic Ram
Manufacturer
Integrated Silicon Solution, Inc.
Datasheet
IS42VS16100D-DIE
512K Words x 16 Bits x 2 Banks (16-MBIT)
SYNCHRONOUS DYNAMIC RAM
FEATURES
• Clock frequency: 135, 100, 83 MHz
PIN DESCRIPTIONS
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. 00B
07/01/05
A0-A11
A0-A10
A11
A0-A7
DQ0 to DQ15
CLK
CKE
CS
RAS
CAS
Power Supply: 1.8V
Fully synchronous; all signals referenced to a
positive clock edge
Two banks can be operated simultaneously and
independently
Dual internal bank controlled by A11 (bank
select)
Programmable burst length (1, 2, 4, 8, full page)
Programmable burst sequence: Sequential/
Interleave
Programmable full and half drive strength
Programmable CAS latency (2, 3 clocks)
2048 refresh cycles every 32 ms
Random column address every clock cycle
Burst read/write and burst read/single write
operations capability
Byte controlled by LDQM and UDQM
Auto Refresh and Self Refresh modes
Partial Array Self-Refresh
Power Down and Deep Power Down
Pads located along edges of die
Address Input
Row Address Input
Bank Select Address
Column Address Input
Data DQ
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
1-800-379-4774
DESCRIPTION
ISSI
organized as a 524,288-word x 16-bit x 2-bank for
improved performance. The synchronous DRAMs
achieve high-speed data transfer using pipeline
architecture. All inputs and outputs signals refer to the
rising edge of the clock input. Note: This is a summary
datasheet specific to the die format. Please refer to the
IS42VS16100D datasheet for complete device
specifications.
KEY TIMING PARAMETERS
BONDING DIAGRAM
WE
LDQM
UDQM
V
Vss
V
V
NC
Parameter
Clock Cycle Time
Clock Frequency
Access Time from Clock
DD
DDQ
SSQ
’s 16Mb Synchronous DRAM IS42VS16100D is
NC
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
CAS Latency = 3
CAS Latency = 2
NC NC
Write Enable
Lower Bye, Input/Output Mask
Upper Bye, Input/Output Mask
Power
Ground
Power Supply for DQ Pin
Ground for DQ Pin
No Connection
ADVANCED INFORMATION
NC
NC
NC
LOGO
ISSI
JULY 2005
-7.5
133
100
7.4
10
6
8
NC
100
-10
10
12
83
7
8
MHz
MHz
Unit
ns
ns
ns
ns
®
1

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