m36l0t7050b0 STMicroelectronics, m36l0t7050b0 Datasheet - Page 15

• Manufacturer Part Number: m36l0t7050b0
• Description: 128mbit Multiple Bank, Multi-level, Burst Flash Memory 32mbit 2m X16 Psram, Multi-chip Package
• Manufacturer: STMicroelectronics

PACKAGE MECHANICAL
Figure 7. Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch, Bottom View Outline
Note: Drawing is not to scale.
Table 10. Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch, Package Data
Symbol
FE1
ddd
SD
A1
A2
D1
E1
E2
FD
FE
SE
A
D
E
b
e
E
E2
10.000
0.850
0.350
8.000
5.600
7.200
8.800
0.800
1.200
1.400
0.600
0.400
0.400
Typ
E1
FE
BALL "A1"
FE1
SE
A
millimeters
0.200
0.300
7.900
9.900
Min
–
FD
D1
D
SD
10.100
1.200
0.400
8.100
0.100
Max
–
A1
e
b
A2
0.0335
0.0138
0.3150
0.2205
0.3937
0.2835
0.3465
0.0315
0.0472
0.0551
0.0236
0.0157
0.0157
Typ
M36L0T7050T0, M36L0T7050B0
inches
0.0079
0.0118
0.3110
0.3898
Min
BGA-Z42
ddd
–
0.0472
0.0157
0.3189
0.0039
0.3976
Max
–
15/18