mx25l3237d Macronix International Co., mx25l3237d Datasheet - Page 3

• Manufacturer Part Number: mx25l3237d
• Description: Serial Flash Memory
• Manufacturer: Macronix International Co.

P/N: PM1393
POWER-ON STATE ................................................................................................................................................... 26
ELECTRICAL SPECIFICATIONS .............................................................................................................................. 27
Timing Analysis ....................................................................................................................................................... 32
(17) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ................................................. 23
(18) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) ............................................. 23
Table 7. ID Definitions ....................................................................................................................................... 24
(19) Enter Secured OTP (ENSO) ...................................................................................................................... 24
(20) Exit Secured OTP (EXSO) ........................................................................................................................ 24
(21) Read Security Register (RDSCUR) ........................................................................................................... 24
(22) Write Security Register (WRSCUR) ........................................................................................................... 25
Table 8. Security Register Definition ................................................................................................................. 25
Figure 2.Maximum Negative Overshoot Waveform ............................................................................................ 27
ABSOLUTE MAXIMUM RATINGS ................................................................................................................... 27
CAPACITANCE TA = 25 C, f = 1.0 MHz ........................................................................................................... 27
Figure 3. Maximum Positive Overshoot Waveform ............................................................................................ 27
Figure 4. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL ............................................................. 28
Figure 5. OUTPUT LOADING .......................................................................................................................... 28
Table 9. DC CHARACTERISTICS (Temperature = -40 C to 85 C for Industrial grade) ....................................... 29
Table 10. DC VOLTAGE CHARACTERISTICS .................................................................................................. 30
Table 11. AC CHARACTERISTICS (Temperature = -40 C to 85 C for Industrial grade) .................................... 31
Figure 6. Serial Input Timing ............................................................................................................................. 32
Figure 7. Output Timing .................................................................................................................................... 32
Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1 ..................................................... 33
Figure 9. Write Enable (WREN) Sequence (Command 06) ................................................................................ 33
Figure 10. Write Disable (WRDI) Sequence (Command 04) ............................................................................... 33
Figure 11. Read Identification (RDID) Sequence (Command 9F) ....................................................................... 34
Figure 12. Read Status Register (RDSR) Sequence (Command 05) ................................................................. 34
Figure 13. Write Status Register (WRSR) Sequence (Command 01) ................................................................ 34
Figure 14. Read Data Bytes (READ) Sequence (Command 03) ....................................................................... 35
Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) .................................................... 35
Figure 16. 2 x I/O Read Mode Sequence (Command BB) ................................................................................. 36
Figure 17. 4 x I/O Read Mode Sequence (Command EB) ................................................................................. 36
Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB) ............................................... 37
Figure 19. Page Program (PP) Sequence (Command 02) ................................................................................. 38
Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38) ................................................................... 38
Figure 21. Continously Program (CP) Mode Sequence with Hardware Detection (Command AD) ....................... 39
Figure 22. Sector Erase (SE) Sequence (Command 20) .................................................................................. 39
Figure 23. Block Erase (BE) Sequence (Command D8) ................................................................................... 39
Figure 24. Chip Erase (CE) Sequence (Command 60 or C7) ............................................................................ 40
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MX25L3237D
REV. 0.02, JUN. 13, 2008