74AHC1G09GW,125 NXP Semiconductors, 74AHC1G09GW,125 Datasheet
74AHC1G09GW,125
Specifications of 74AHC1G09GW,125
74AHC1G09GW-G
935279914125
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74AHC1G09GW,125 Summary of contents
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AND gate with open-drain output Rev. 02 — 18 December 2007 1. General description The 74AHC1G09 is a high-speed Si-gate CMOS device. The 74AHC1G09 provides the 2-input AND function with open-drain output. The output of the 74AHC1G09 is ...
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... NXP Semiconductors 5. Functional diagram 001aad598 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration SOT353-1 (TSSOP5) and SOT753 (SC-74A) 6.2 Pin description Table 3. Pin description Symbol Pin GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level high-impedance OFF-state. ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input clamping current IK I output clamping current OK I output current ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V LOW-level output voltage 4.0 mA 8.0 mA input leakage GND current 5 OFF-state output current GND supply current 5 input I capacitance 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 0 V; for test circuit see ...
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... NXP Semiconductors 12. Waveforms A, B input Y output Measurement points are given the typical voltage output level that occur with the output load. OL Fig 5. The data input ( output (Y) propagation delays Table 9. Measurement points Input V M 0.5V CC GENERATOR Test data is given in Table 10. Definitions for test circuit Load capacitance including jig and probe capacitance ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74AHC1G09_2 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... Release date 74AHC1G09_2 20071218 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT753 added to • Quick reference data section removed. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 2 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 14 Abbreviations ...