ADSP-21266_07 AD [Analog Devices], ADSP-21266_07 Datasheet - Page 3

• Manufacturer Part Number: ADSP-21266_07
• Description: Embedded Processor
• Manufacturer: AD [Analog Devices]

TABLE OF CONTENTS
Summary ............................................................... 1
Key Features ........................................................... 2
Table of Contents .................................................... 3
Revision History ...................................................... 3
General Description ................................................. 4
Pin Function Descriptions ........................................ 11
ADSP-21266 Specifications ....................................... 15
136-Ball BGA Pin Configurations ............................... 39
144-Lead LQFP Pin Configurations ............................. 42
Package Dimensions ................................................ 43
Ordering Guide ...................................................... 44
ADSP-21266 Family Core Architecture ...................... 4
ADSP-21266 Memory and I/O Interface Features ......... 6
Target Board JTAG Emulator Connector .................... 9
Development Tools ............................................... 9
Evaluation Kit ..................................................... 10
Designing an Emulator-Compatible DSP Board (Target) 10
Additional Information ......................................... 10
Address Data Pins as Flags ..................................... 14
Core Instruction Rate to CLKIN Ratio Modes ............. 14
Address Data Modes ............................................. 14
Operating Conditions ........................................... 15
Electrical Characteristics ........................................ 15
Package Information ............................................ 16
ESD Caution ...................................................... 16
Absolute Maximum Ratings ................................... 16
Timing Specifications ........................................... 16
Output Drive Currents .......................................... 37
Test Conditions ................................................... 37
Capacitive Loading ............................................... 37
Environmental Conditions ..................................... 38
Thermal Characteristics ........................................ 38
Surface-Mount Design .......................................... 44
Rev. C | Page 3 of 44 | October 2007
REVISION HISTORY
9/07—Rev. B to Rev. C
Added new section Package Information .................. 16
Revised Timing Specifications ................................ 16
Ordering Guide .................................................. 44
Corrected all outstanding document errata.
ADSP-21266