MPC8358E_11 FREESCALE [Freescale Semiconductor, Inc], MPC8358E_11 Datasheet - Page 65

• Manufacturer Part Number: MPC8358E_11
• Description: PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8358E is available in
a plastic ball grid array (PBGA), see
Section 21.2, “Mechanical Dimensions of the PBGA
21.1
The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 29
mm x 29 mm, 668 plastic ball grid array (PBGA).
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Package Parameters for the PBGA Package
Section 21.1, “Package Parameters for the PBGA
29 mm x 29 mm
668
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZQ package)
95.5 Sn/0.5 Cu/4Ag (VR package)
0.64 mm
Package,” for information on the package.
Package and Pin Listings
Package,” and
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