MPC8358E_11 FREESCALE [Freescale Semiconductor, Inc], MPC8358E_11 Datasheet - Page 84

• Manufacturer Part Number: MPC8358E_11
• Description: PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal
23 Thermal
This section describes the thermal specifications of the MPC8358E.
23.1
Table 75
23.2
For the following sections, P
See
84
•
Table 5
Junction-to-ambient Natural Convection on single layer board (1s)
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@1 m/s) on single layer board (1s)
Junction-to-ambient (@ 1 m/s) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-Package Natural Convection on Top
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
2. Per JEDEC JESD51-2 and JEDEC JESD51-9 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal. 1 m/sec is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
measured on the top surface of the board near the package.
Method 1012.1).
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
Engine clock rate 300 MHz while the input clock rate is 33 MHz. Conf No. ‘s10’ and ‘c1’ are
selected from
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
To configure the device with CSB clock rate of 266 MHz, core rate of 400 MHz, and QUICC
provides the package thermal characteristics for the 668 29 mm x 29 mm PBGA package.
Thermal Characteristics
Thermal Management Information
for typical power dissipations values.
Table 75. Package Thermal Characteristics for the PBGA Package
Table
74. SPMF is 1000, CORPLL is 0000011, CEPMF is 01001, and CEPDF is 0.
Characteristic
D
= (V
DD
× I
DD
) + P
I/O
where P
I/O
is the power dissipation of the I/O drivers.
Symbol
R
R
R
R
R
R
ψ
θJMA
θJMA
θJC
θJA
θJA
θJB
JT
Value
20
14
15
11
6
4
4
Freescale Semiconductor
°C/W
°C/W
°C/W
•C/W
•C/W
•C/W
•C/W
Unit
C/W
C/W
C/W
C/W
Notes
1, 2, 3
1, 2
1, 3
1, 3
4
5
6