HYB18T512161B2F-20/25 QIMONDA [Qimonda AG], HYB18T512161B2F-20/25 Datasheet - Page 4

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HYB18T512161B2F-20/25

Manufacturer Part Number
HYB18T512161B2F-20/25
Description
512-Mbit x16 DDR2 SDRAM
Manufacturer
QIMONDA [Qimonda AG]
Datasheet
1.2
The 512-Mb DDR2 DRAM is a high-speed Double-Data-
Rate-Two CMOS DRAM device containing 536,870,912 bits
and internally configured as a quad-bank DRAM. The 512-Mb
device is organized as 8 Mbit × 16 I/O × 4 banks chip. These
devices achieve high speed transfer rates starting at
800 Mb/sec/pin for general applications.
The device is designed to comply with all DDR2 DRAM key
features:
1. posted CAS with additive latency,
2. write latency = read latency - 1,
3. normal and weak strength data-output driver,
4. Off-Chip Driver (OCD) impedance adjustment
5. On-Die Termination (ODT) function.
Rev. 1.1, 2007-06
05152007-ZYAH-ACMZ
Description
4
All of the control and address inputs are synchronized with a
pair of externally supplied differential clocks. Inputs are
latched at the cross point of differential clocks (CK rising and
CK falling). All I/Os are synchronized with a single ended
DQS or differential DQS-DQS pair in a source synchronous
fashion.
A 15-bit address bus is used to convey row, column and bank
address information in a RAS-CAS multiplexing style.
An Auto-Refresh and Self-Refresh mode is provided along
with various power-saving power-down modes.
The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode of
operation.
The DDR2 SDRAM is available in P-TFBGA package.
512-Mbit Double-Data-Rate-Two SDRAM
HYB18T512161B2F–20/25
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