MC9S08GW64_11 FREESCALE [Freescale Semiconductor, Inc], MC9S08GW64_11 Datasheet - Page 39

• Manufacturer Part Number: MC9S08GW64_11
• Description: HC08 instruction set with added BGND instruction
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

1
1
2
3
3.13
Freescale Semiconductor
Num
Factory trim is performed at the room temperature.
All accuracy numbers assume the ADC is calibrated with V
Typical values assume V
only and are not tested in production.
1 LSB = (V
10
11
12
13
14
1
2
3
4
5
6
7
8
9
VREF Characteristics
C
P
P
C
P
P
C
C
C
C
C
C
C
C
C
REFH
Supply voltage
Operating temperature range
Maximum Load
Voltage output room temperature
Voltage output room temperature
Load Regulation Mode = 10 at 1mA
load
Line Regulation (Power Supply
Rejection)
Powered down Current (Stop Mode,
VREFEN = 0, VRSTEN = 0)
Bandgap only (Mode[1:0] 00)
Low Power buffer (Mode[1:0] 01)
Tight Regulation buffer (Mode[1:0] 10)
Low Power and Tight Regulation
(Mode[1:0] 11)
–V
–40 °C
85 °C
REFL
)/2
DDAD
N
Characteristic
= 3.0 V, Temp = 25 C, f
MC9S08GW64 Series MCU Data Sheet, Rev. 3
Table 20. Electrical specifications
ADCK
Operation across Temperature
Factory trimmed
Factory trimmed
Factory trimmed
=2.0MHz unless otherwise stated. Typical values are for reference
Untrimmed
Mode = 10
REFH
Symbol
Power Consumption
V
Load Bandwidth
T
DC
AC
DD
op
I
I
I
I
I
=V
DDAD
1
±0.1 from room temp voltage
1.80
Min
–40
20
1.185–1.200
1.180–1.22
1.19–1.200
1.070–1.3
–60
Electrical Characteristics
Max
3.60
1.15
100
100
125
1.1
85
10
75
V/mA
Unit
mA
mA
mV
mA
A
A
A
dB
C
V
V
V
V
V
39