TDA8035HN/C1,157 NXP Semiconductors, TDA8035HN/C1,157 Datasheet - Page 17

• Manufacturer Part Number: TDA8035HN/C1,157
• Description: Interface - Specialized SMART CARD INTERFACE
• Manufacturer: NXP Semiconductors

Specifications of TDA8035HN/C1,157

• Rohs: yes
• Factory Pack Quantity: 2450

NXP Semiconductors
9. Limiting values
10. Thermal characteristics
Table 6.
TDA8035HN
Product data sheet
COMPANY PUBLIC
Symbol
R
th(j-a)
Thermal characteristics
Package name Parameter
HVQFN32
All card contacts are protected against a short-circuit with any other card contact.
Stress beyond the limiting values can damage the device permanently. The values are
stress ratings only and functional operation of the device under these conditions is not
implied.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
V
V
T
T
T
P
V
amb
stg
j
DDP
DD(INTF)
IH
tot
ESD
thermal resistance from junction
to ambient
Limiting values
Parameter
power supply voltage
interface supply voltage
HIGH-level input
voltage
ambient temperature
storage temperature
junction temperature
total power dissipation
electrostatic discharge
voltage
All information provided in this document is subject to legal disclaimers.
Rev. 2.1 — 3 December 2012
Conditions
CS, PRESN,
CMDVCCN, CLKDIV2,
CLKDIV1, EN_1.8VN,
EN_5V/3VN, RSTIN,
OFFN, PORADJ, XTAL1,
I/OUC, AUX1UC, AUX2UC,
V
I/O, RST, AUX1, AUX2 and
CLK
Human Body Model (HBM)
on card pins I/O, RST, V
AUX1, CLK, AUX2, PRESN
within typical application
Human Body Model (HBM)
on all other pins
Machine Model (MM) on
all pins
Field Charged Device
Model (FCDM) on all pins
DDP
Conditions
in free air with 4 thermal vias
on PCB
in free air without thermal
vias on PCB
, V
DD(INTF)
CC
,
TDA8035HN
Min
0.3
0.3
0.3
0.3
25
55
10
2
200
500
Smart card interface
Typ
55
63
© NXP B.V. 2012. All rights reserved.
+125
0.45
+200
+500
Max
6
4.1
4.1
5.75
+85
+150
+10
+2
Unit
K/W
K/W
Unit
V
V
V
V
C
C
C
W
kV
kV
V
V
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