TDA8035HN/C1,157 NXP Semiconductors, TDA8035HN/C1,157 Datasheet - Page 27

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TDA8035HN/C1,157

Manufacturer Part Number
TDA8035HN/C1,157
Description
Interface - Specialized SMART CARD INTERFACE
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8035HN/C1,157

Rohs
yes
Factory Pack Quantity
2450
NXP Semiconductors
14. Soldering
15. Abbreviations
16. Revision history
Table 9.
TDA8035HN
Product data sheet
COMPANY PUBLIC
Document ID
TDA8035HN v. 2.1
Modifications:
TDA8035HN v. 2.0
Modifications:
TDA8035HN v. 1.1
Modifications:
TDA8035HN v. 1.0
Revision history
For all "Surface mount reflow soldering" information for the SOT617 packaging, utilize the
following NXP Semiconductors documentation link:
http://www.nxp.com/documents/application_note/AN10365.pdf
Table 8.
Acronym
ESD
Release date
20121203
20111220
20110706
20110419
Table 3 “Pin
Section 8.1 “Power
Table 7 “Characteristics of
Figure 13 “Application
All text updated to NXP standards
Table 7 “Characteristics of IC”: V
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
ElectroStatic Discharge
description”: updated
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Rev. 2.1 — 3 December 2012
supply”: updated
diagram”: Table note (7) added
IC”: updated
th(L)(PORADJ)
Change notice
-
-
-
-
values updated
TDA8035HN
Supersedes
TDA8035HN v. 2.0
TDA8035HN v. 1.1
TDA8035HN v. 1.0
-
Smart card interface
© NXP B.V. 2012. All rights reserved.
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