W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 18

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.2.2 Instruction Set Table 1 (Erase, Program Instructions)
Write Enable
Write Disable
Read Status Register-1
Read Status Register-2
Write Status Register
Page Program
Quad Page Program
Sector Erase (4KB)
Block Erase (32KB)
Block Erase (64KB)
Chip Erase
Erase Suspend
Erase Resume
Power-down
Continuous Read Mode
Reset
Notes:
1.
2.
3.
4.
INSTRUCTION NAME
Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “()” indicate data being
read from the device on the DO pin.
The Status Register contents will repeat continuously until /CS terminates the instruction.
Quad Page Program Input Data:
This instruction is recommended when using the Dual or Quad “Continuous Read Mode” feature. See section
11.2.32 for more information.
(4)
IO0 = (D4, D0, ……)
IO1 = (D5, D1, ……)
IO2 = (D6, D2, ……)
IO3 = (D7, D3, ……)
(CODE)
BYTE 1
C7h/60h
D8h
7Ah
B9h
06h
04h
05h
35h
01h
02h
32h
20h
52h
75h
FFh
(S15-S8)
(S7–S0)
A23–A16
A23–A16
A23–A16
A23–A16
A23–A16
BYTE 2
(S7–S0)
FFh
(2)
(2)
BYTE 3
(S15-S8)
- 18 -
A15–A8
A15–A8
A15–A8
A15–A8
A15–A8
BYTE 4
A7–A0
A7–A0
A7–A0
A7–A0
A7–A0
(1)
(D7–D0, …)
BYTE 5
(D7–D0)
W25Q16BV
(3)
BYTE 6