W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 66

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.
Notes:
1a. Only the 2
1b. The “W” prefix is not included on the part marking.
2a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape
2b. For shipments with OTP feature enabled, please specify when placing orders.
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
16B = 16M-bit
V = 2.7V to 3.6V
SN = 8-pin SOIC 150-mil
SS = 8-pin SOIC 208-mil
G =
P =
I = Industrial (-40°C to +85°C)
ORDERING INFORMATION
T) or Tray (shape S), when placing orders.
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
Green Package with Status Register Power Lock-Down & OTP enabled
nd
letter is used for the part marking; WSON package type ZP is not used for the part marking.
(2)
DA = 8-pin PDIP 300-mil
ZP = 8-pad WSON 6x5mm
(1)
- 66 -
W 25Q 16B V xx
SF = 16-pin SOIC 300-mil
W25Q16BV
2
O
(1)
3
)