W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 2

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
GENERAL DESCRIPTION ............................................................................................................... 5
FEATURES....................................................................................................................................... 5
PIN CONFIGURATION SOIC 150 / 208-MIL ................................................................................... 6
PAD CONFIGURATION WSON 6X5-MM ........................................................................................ 6
PAD CONFIGURATION PDIP 300-MIL ........................................................................................... 7
PIN DESCRIPTION SOIC 150/208-MIL, PDIP 300-MIL AND WSON 6X5-MM............................... 7
PIN CONFIGURATION SOIC 300-MIL ............................................................................................ 8
PIN DESCRIPTION SOIC 300-MIL .................................................................................................. 8
8.1
8.2
8.3
8.4
8.5
8.6
BLOCK DIAGRAM.......................................................................................................................... 10
FUNCTIONAL DESCRIPTION ....................................................................................................... 11
10.1
10.2
CONTROL AND STATUS REGISTERS ........................................................................................ 13
11.1
11.2
Package Types..................................................................................................................... 9
Chip Select (/CS).................................................................................................................. 9
Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9
Write Protect (/WP)............................................................................................................... 9
HOLD (/HOLD) ..................................................................................................................... 9
Serial Clock (CLK) ................................................................................................................ 9
SPI OPERATIONS ............................................................................................................. 11
10.1.1
10.1.2
10.1.3
10.1.4
WRITE PROTECTION ....................................................................................................... 12
10.2.1
STATUS REGISTER .......................................................................................................... 13
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
11.1.9
INSTRUCTIONS................................................................................................................. 17
11.2.1
Standard SPI Instructions...................................................................................................11
Dual SPI Instructions ..........................................................................................................11
Quad SPI Instructions.........................................................................................................11
Hold Function .....................................................................................................................11
Write Protect Features........................................................................................................12
BUSY..................................................................................................................................13
Write Enable Latch (WEL) ..................................................................................................13
Block Protect Bits (BP2, BP1, BP0)....................................................................................13
Top/Bottom Block Protect (TB)...........................................................................................13
Sector/Block Protect (SEC) ................................................................................................13
Status Register Protect (SRP1, SRP0)...............................................................................14
Erase Suspend Status (SUS) .............................................................................................14
Quad Enable (QE) ..............................................................................................................14
Status Register Memory Protection ....................................................................................16
Manufacturer and Device Identification ..............................................................................17
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