W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 67

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

14.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q16BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
Note:
PACKAGE TYPE
WSON-8 6x5mm
SOIC-16 300mil
SOIC-8 150mil
SOIC-8 208mil
PDIP-8 300mil
1. WSON package type ZP is not used in the top side marking.
2. These Package types are Special Order Only, please contact Winbond for more information.
DA
SN
SF
ZP
SS
(2)
(1)
(2)
(2)
DENSITY
16M-bit
16M-bit
16M-bit
16M-bit
16M-bit
PRODUCT NUMBER
W25Q16BVSNIG
W25Q16BVDAIG
W25Q16BVSNIP
W25Q16BVSSIG
W25Q16BVSFIG
W25Q16BVZPIG
W25Q16BVDAIP
W25Q16BVSSIP
W25Q16BVSFIP
W25Q16BVZPIP
- 67 -
Publication Release Date: July 08, 2010
TOP SIDE MARKING
25Q16BVNIG
25Q16BVNIP
25Q16BVSIG
25Q16BVFIG
25Q16BVAIG
25Q16BVSIP
25Q16BVFIP
25Q16BVAIP
25Q16BVIG
25Q16BVIP
W25Q16BV
Revision F