BSS139H6327XT Infineon Technologies, BSS139H6327XT Datasheet

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BSS139H6327XT

Manufacturer Part Number
BSS139H6327XT
Description
MOSFET SIPMOS Small Signal Transistor
Manufacturer
Infineon Technologies
Datasheet

Specifications of BSS139H6327XT

Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
250 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
30 mA
Resistance Drain-source Rds (on)
14 Ohms at 10 V
Configuration
Single
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
PG-SOT-23
Fall Time
182 ns
Gate Charge Qg
2.3 nC
Minimum Operating Temperature
- 55 C
Power Dissipation
360 mW
Rise Time
5.4 ns
Typical Turn-off Delay Time
43 ns
Part # Aliases
BSS139 BSS139H6327XTSA1 H6327
Rev. 1.
8
° Halogen free according to IEC61249-2-21
° Qualified according to AEC Q101
1)
Features
• N-channel
• Depletion mode
• dv /dt rated
• Available with V
• Pb-free lead-plating; RoHS compliant
Maximum ratings, at T
Parameter
Continuous drain current
Pulsed drain current
Reverse diode dv /dt
Gate source voltage
ESD class
(JESD22-A114-HBM)
Power dissipation
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
SIPMOS
Type
BSS139
BSS139
see table on next page and diagram 11
®
Small-Signal-Transistor
Package
PG-SOT-23
PG-SOT-23
GS(th)
indicator on reel
j
=25 °C, unless otherwise specified
Tape and Reel Information
H6327: 3000 pcs/ree
H6906: 3000 pcs/reel sorted in V
Symbol Conditions
I
I
dv /dt
V
P
T
D
D,pulse
j
GS
tot
, T
stg
T
T
T
I
di /dt =200 A/µs,
T
T
page 1
D
A
A
A
j,max
A
=0.1 A,V
=25 °C
=70 °C
=25 °C
=25 °C
=150 °C
DS
=200 V,
S(th)
Product Summary
V
R
I
DSS,min
DS
DS(on),max
bands    
1)
STs
STs
Marking
0 (<250V)
-55 ... 150
55/150/56
Value
0.10
0.08
0.36
±20
0.4
PG-SOT-23
6
Pb-free
Yes
Yes
250
0.03
30
BSS139
Unit
A
kV/µs
V
W
°C
20
V
A
09
-08-18

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BSS139H6327XT Summary of contents

Page 1

SIPMOS Small-Signal-Transistor Features • N-channel • Depletion mode • dv /dt rated • Available with V indicator on reel GS(th) • Pb-free lead-plating; RoHS compliant ° Halogen free according to IEC61249-2-21 ° Qualified according to AEC Q101 Type Package ...

Page 2

Parameter Thermal characteristics Thermal resistance, junction - ambient Electrical characteristics Static characteristics Drain-source breakdown voltage Gate threshold voltage Drain-source cutoff current Gate-source leakage current On-state drain current Drain-source on-state resistance Transconductance Threshold voltage V sorted in bands GS(th) ...

Page 3

Parameter Dynamic characteristics Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode ...

Page 4

Power dissipation P =f(T ) tot A 0.4 0.3 0.2 0 Safe operating area I =f =25 ° parameter limited by on-state resistance ...

Page 5

Typ. output characteristics I =f =25 ° parameter 0 0.16 0.12 0.08 0. Typ. transfer characteristics I =f |>2|I |R ...

Page 6

Drain-source on-state resistance R =f =0.015 A; V DS(on % -60 - Threshold voltage bands I =f =25 °C D ...

Page 7

Forward characteristics of reverse diode I =f parameter 0.1 150 °C 0.01 0.001 0 0 Drain-source breakdown voltage V =f =250 µA BR(DSS 300 280 260 240 ...

Page 8

Package Outline: Footprint: Dimensions in mm Rev Packaging: page 8 BSS139 2009-08-18 ...

Page 9

... Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system ...

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