HIP2100EIB Intersil, HIP2100EIB Datasheet - Page 12

• Manufacturer Part Number: HIP2100EIB
• Description: IC DRIVER HALF BRIDGE 8-SOIC
• Manufacturer: Intersil

Specifications of HIP2100EIB

• Configuration: Half Bridge
• Input Type: PWM
• Delay Time: 20ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 114V
• Voltage - Supply: 9 V ~ 14 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Small Outline Exposed Pad Plastic Packages (EPSOIC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
N
N
1
1
0.25(0.010)
2
2
-A-
TOP VIEW
SIDE VIEW
BOTTOM VIEW
INDEX
AREA
3
3
e
B
D
P
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
P1
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
E
-B-
B S
A
12
H
A1
α
0.25(0.010)
0.10(0.004)
M
L
h x 45°
B
M
C
HIP2100
M8.15C
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
SYMBOL
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
dimensions are not necessarily exact.
variations. Values shown are maximum size of exposed pad
within lead count and body size.
A1
P1
A
B
C
D
E
H
N
α
P
e
h
L
0.056
0.001
0.0138
0.0075
0.189
0.150
0.230
0.010
0.016
MIN
0°
-
-
0.050 BSC
INCHES
8
MAX
0.066
0.005
0.0192
0.0098
0.196
0.157
0.244
0.016
0.035
0.126
0.099
8°
1.43
0.03
0.35
0.19
4.80
3.811
5.84
0.25
0.41
MILLIMETERS
MIN
0°
-
-
1.27 BSC
8
MAX
1.68
0.13
0.49
0.25
4.98
3.99
6.20
0.41
0.89
3.200
2.514
8°
Rev. 1 6/05
NOTES
FN4022.14
11
11
9
3
4
5
6
7
-
-
-
-
-
-