VNH3ASP30-E STMicroelectronics, VNH3ASP30-E Datasheet
VNH3ASP30-E
Specifications of VNH3ASP30-E
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VNH3ASP30-E Summary of contents
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... Current-sense output proportional to motor current ® ■ Package: ECOPACK Description The VNH3ASP30 full-bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high-side driver (HSD) and two low- side switches. The HSD switch is designed using STMicroelectronics proprietary VIPower™ M0 ...
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... Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Thermal calculation in clockwise and anti-clockwise operation in Steady- state mode 26 Thermal resistances definition (values according to the PCB heatsink area) 26 Thermal calculation in Transient mode . . . . . . . . . . . . . . . . . . . . . . . . . 26 Single pulse thermal impedance definition (values according to the PCB heatsink area) 26 VNH3ASP30-E ...
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... VNH3ASP30-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Block description Table 3. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Pin functions description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7. Logic inputs (INA, INB, ENA, ENB Table 8. PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Switching (V = 13V Table 10. Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 11. Current sense (9V < ...
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... Figure 41. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . 27 Figure 42. Thermal fitting model of an H-bridge in MultiPowerSO- Figure 43. MultiPowerSO-30 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 44. MultiPowerSO-30 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 45. MultiPowerSO-30 tube shipment (no suffix Figure 46. MultiPowerSO-30 tape and reel shipment (suffix “TR” 4/33 VNH3ASP30 ...
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... VNH3ASP30-E 1 Block diagram and pin description Figure 1. Block diagram CLAMP OUT A CLAMP GND A Table 2. Block description Name Logic control Overvoltage + undervoltage High-side and low- side clamp voltage High-side and low- side driver Linear current limiter Overtemperature protection Fault detection OVERTEMPERATURE DRIVER ...
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... Status of high-side and low-side switches B; open drain output B B Counter clockwise input B , Heat Slug2 Source of high-side switch B / Drain of low-side switch B B Source of low-side switch A A Source of low-side switch B B must be externally connected together. VNH3ASP30-E 30 OUT A Nc OUT A GND A Heat Slug3 GND A ...
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... VNH3ASP30-E Table 4. Pin functions description Name V Battery connection CC GND , GND Power grounds; must always be externally connected together A B OUT , OUT Power connections to the motor A B Voltage controlled input pins with hysteresis, CMOS compatible: These two pins control the state of the bridge in normal operation according to the truth table (brake ...
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... Storage temperature stg 8/ DIAG / ENB DIAG / GND PWM ENA V ENB V pw Parameter and IN pins /EN and DIAG OUT , VNH3ASP30 OUTA OUT A I OUTB OUT SENSE SENSE OUTB GND B GND I GND Value +41 30 -30 ±10 ±10 /EN pins ±10 -3/+ Internally limited -40 to 150 -55 to 150 V ...
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... VNH3ASP30-E 2.2 Electrical characteristics -40°C < Table 6. Power section Symbol Parameter Operating supply V CC voltage I Supply current S Static high-side R ONHS resistance Static low-side R ONLS resistance High-side V freewheeling diode f forward voltage High-side off-state I output current L(off) (per channel) Dynamic cross conduction current Table 7. ...
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... Test conditions Input rise time < 1µs (see Figure 6) Input rise time < 1µs (see Figure 6) (see Figure 5) (see Figure 5) (see Figure 4) (see Figure 7) Parameter to GND) CC VNH3ASP30-E Min Typ Max 1.25 1 3. -6.0 -4.5 -3.0 Min Typ Max 0 250 250 ...
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... VNH3ASP30-E Table 11. Current sense (9V < V Symbol OUT OUT ( Analog sense current drift Analog sense current drift 2 2 Analog sense leakage I SENSEO current 1. Analog sense current drift is deviation of factor K for a given device over (-40°C to 150°C and 9V < V < 16V) with respect to its value measured < ...
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... Electrical specifications Figure 4. Definition of the delay times measurement V INA V INB PWM I LOAD Figure 5. Definition of the low-side switching times 12/33 t DEL PWM V OUTA 20% VNH3ASP30 DEL t 80 ...
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... VNH3ASP30-E Figure 6. Definition of the high-side switching times V INA V OUTA Figure 7. Definition of dynamic cross conduction current during a PWM operation PWM I MOTOR V OUTB D(on) 90 Electrical specifications D(off 13/33 ...
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... DIAG /EN OUT OUT DIAG /EN DIAG / Fault Information VNH3ASP30-E CS Operating mode B High Imp. Brake Clockwise (CW SENSE OUT Counterclockwise (CCW) High Imp. Brake to GND ) A OUT OUT OPEN L OPEN H L Protection Action CS High Imp ...
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... VNH3ASP30-E Table 14. Electrical transient requirements ISO T/R - 7637/1 Test Pulse ISO T/R - 7637/1 Test Pulse ( For load dump exceeding the above value a centralized suppressor must be adopted. Class C E Test Level Test Level Test Level II I -25V -50V -75V +25V +50V +75V ...
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... Figure 13. Input low-level voltage V IL 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 100 125 150 175 VNH3ASP30-E Off state supply current (µ 13V -50 - 100 125 150 175 T (° 1mA ...
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... VNH3ASP30-E Figure 14. Input hysteresis voltage V (V) IHYST 2.0 1 9V…16V 1.6 CC 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -50 - (°C) c Figure 16. Delay time during change of operation mode t (µs) DEL 1000 900 V = 13V 800 1ohm 700 L 600 500 400 300 200 100 ...
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... Figure 23. Overvoltage shutdown 100 125 150 175 Figure 25. Current limitation I LIM 100 125 150 175 VNH3ASP30-E ( 9V…16V CC -50 - 100 125 150 175 T (°C) c (V) -50 - 100 125 150 175 T (° 16V CC -50 - 100 125 150 175 T (° ...
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... VNH3ASP30-E Figure 26. On state high-side resistance vs T case R (mOhm) ONHS 13V 12A OUT -50 - (°C) c Figure 28. On state high-side resistance (mOhm) ONHS 12A 70 LOAD 150° 25° -40° (V) CC Figure 30. Output voltage rise time t (µs) R 1.0 0 13V CC 0 1ohm L 0.7 0.6 0.5 ...
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... / PWM OUT GND A S 100K G D /EN pin is considered as an output pin by the device → overtemperature detection on high side A → low-side power MOSFET saturation detection CC VNH3ASP30-E pin is considered as an input pin by the and DIAG / OUT GND MOSFET switches. B +5V 3. ...
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... Figure 33. Half-bridge configuration DIAG /EN A DIAG /EN B PWM OUT A GND Note: The VNH3ASP30-E can be used as a high power half-bridge driver achieving an On resistance per leg of 21 mΩ DIAG /EN and DIAG again, the input signal must rise from low to high level. X pin CC pin CC line (approximately -1 ...
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... Application information Figure 34. Multi-motors configuration DIAG / DIAG / PWM OUT A GND A Note: The VNH3ASP30-E can easily be designed in multi-motors driving applications such as seat positioning systems where only one motor must be driven at a time. DIAG to put unused half-bridges in high impedance. 22/ OUT 2 B GND VNH3ASP30 DIAG ...
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... VNH3ASP30-E Figure 35. Waveforms in full-bridge operation DIAG / DIAG / PWM OUT A OUT B I -> OUTA OUTB CS (*) (*) CS behavior during PWM mode will depend on PWM frequency and duty cycle. NORMAL OPERATION (DIAG DIAG / DIAG / PWM OUT A OUT B I -> OUTA OUTB CS CURRENT LIMITATION/THERMAL SHUTDOWN or OUT LIM I -> ...
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... Application information Figure 36. Waveforms in full-bridge operation (continued ) OUT A OUT B I -> OUTA OUTB DIAG / DIAG / normal 24/33 OUT shorted to V and undervoltage shutdown < nominal operation OUT shorted VNH3ASP30-E undefined undefined normal operation undervoltage shutdown ...
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... VNH3ASP30-E 4 Package and PCB thermal data 4.1 MultiPowerSO-30 thermal data Figure 37. MultiPowerSO-30™ PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 16cm2). Figure 38. Chipset configuration Figure 39. Auto and mutual R ° ...
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... dHSAB thLS dLSA thLSLS + dHSAB thLSLS dLSA = Low-Side Chip Thermal Impedance Junction to Ambient thLSB = Z = Mutual Thermal Impedance Junction to Ambient thHSABLSB = Mutual Thermal Impedance Junction to Ambient between Low-Side values set by user. d VNH3ASP30 JLSA thHSLS dHSA thHSLS thLSLS A thLS thHSLS dHSB ...
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... VNH3ASP30-E Equation 1: pulse calculation formula ⋅ Z THδ where δ Figure 40. MultiPowerSO-30 HSD thermal impedance junction ambient single pulse 100 10 1 0,1 0,001 Figure 41. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse 100 10 1 0,1 0,001 δ Z THtp 1 δ – ⁄ ...
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... The blank space means that the value is the same as the previous one. 28/33 ( Footprint 0.05 0.3 0.5 1.3 14 44.7 0.11 0.21 0.42 1.5 20 46.9 115 0.005 0.008 0.01 0.3 0.6 5 0.0016 0.0032 0.0053 0.075 2.5 VNH3ASP30 39.1 31.6 23.7 36.1 30.4 20 3.5 4.5 5 ...
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... VNH3ASP30-E 5 Package and packing information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. ...
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... Package and packing information Table 17. MultiPowerSO-30 mechanical data (continued) Symbol Figure 44. MultiPowerSO-30 suggested pad layout 30/33 Millimeters Min Typ 15 5.55 4.6 9.6 0.8 0 deg VNH3ASP30-E Max 16.1 6.05 5.1 10.1 1.15 10 deg 7 deg ...
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... VNH3ASP30-E 5.3 Packing information Note: The devices can be packed in tube or tape and reel shipments (see the page 1 for packaging quantities). Figure 45. MultiPowerSO-30 tube shipment (no suffix) C Figure 46. MultiPowerSO-30 tape and reel shipment (suffix “TR”) Dimension A Tube length (± 0. (± 0.13) Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev ...
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... Section 5: Package and packing information on page 29 Updated disclaimer on last page Document reformatted. 4 Table 6: Power section on page values for supply current in Off state Corrected Heat Slug numbers in 5 functions. VNH3ASP30-E Description of changes Figure 33: Half-bridge configuration ® to add ECOPACK package 9: Changed test conditions and max 9: Modified and I ...
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... VNH3ASP30-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...