VNH3ASP30-E STMicroelectronics, VNH3ASP30-E Datasheet - Page 32

• Manufacturer Part Number: VNH3ASP30-E
• Description: IC MOTOR DVR H BRDG 30-MPSO
• Manufacturer: STMicroelectronics
• Type: Half Bridge DC Motor Driverr

Specifications of VNH3ASP30-E

• Applications: Automotive
• Number Of Outputs: 2
• Current - Output: 30A
• Voltage - Supply: 5.5 V ~ 16 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 30-MPSO, MultiPowerSO
• Supply Current: 10 mA
• Mounting Style: SMD/SMT
• Device Type: Motor
• Module Configuration: Full Bridge
• Peak Output Current: 30A
• Output Resistance: 0.03ohm
• Input Delay: 250µs
• Output Delay: 250µs
• Supply Voltage Range: 5.5V To 36V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Revision history
6
32/33
Revision history
Table 18.
06-Feb-2008
01-Jun-2007
6-Feb-2007
Sep-2004
Dec-2005
Date
Document revision history
Revision
1
2
3
4
5
First issue
Resistance per leg modification
on page 21
Document converted into new ST template.
Changed
Removed Table 7. Thermal Data from page 4
Table 6: Power section on page
values for supply current in Off state and On state
Table 7: Logic inputs (INA, INB, ENA, ENB) on page
parameter descriptions for I
Table 8: PWM on page
and I
Table 10: Protection and diagnostic on page
except I
Table 11 on page
current drift
Section Table 13.: Truth table in fault conditions (detected on OUTA)
on page
Figure 6: Definition of the high-side switching times on page
Added vertical limitation line to left side of t
Figure 36: Waveforms in full-bridge operation (continued ) on
page
Added
Added
Added
Updated disclaimer on last page
Document reformatted.
Table 6: Power section on page
values for supply current in Off state
Corrected Heat Slug numbers in
functions.
PWH
24: Added dotted vertical limitation lines
Section 2.3: Electrical characteristics curves on page 16
Section 4: Package and PCB thermal data on page 25
Section 5: Package and packing information on page 29
LIM
14: Changed first of two fault conditions
Features on page 1
and V
CLP
11: Changed test conditions for K
Description of changes
10: Modified parameter descriptions for I
INL
to add ECOPACK
and I
9: Changed test conditions and max
9: changed test conditions and max
Figure 33: Half-bridge configuration
Table 3: Pin definitions and
INH
D(off)
10: Modified all symbols
®
arrow
package
2
9: Modified
VNH3ASP30-E
analog sense
13:
PWL