MC33887DHR2 Freescale Semiconductor, MC33887DHR2 Datasheet - Page 33

• Manufacturer Part Number: MC33887DHR2
• Description: IC H-BRIDGE 5A CURR FDBK 20-HSOP
• Manufacturer: Freescale Semiconductor

Specifications of MC33887DHR2

• Applications: DC Motor Controller, H Bridge
• Number Of Outputs: 1
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• For Use With: KIT33887PNBEVB - KIT EVAL 33887 5A H-BRIDGE PQFNKIT33887DWBEVB - KIT EVAL 33887 5A H-BRIDGE SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
data sheet. The addendum provides thermal performance information that may
be critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
There is a single heat source (P), a single junction temperature (T
resistance (R
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 7.
Analog Integrated Circuit Device Data
Freescale Semiconductor
NOTES:
trace near the center lead.
JESD51-5.
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the center
4.Single layer thermal test board per JEDEC JESD51-3 and
5.Thermal resistance between the die junction and the exposed
This thermal addendum is provided as a supplement to the MC33887 technical
The MC33887 is offered in a 20 pin HSOP exposed pad, single die package.
The stated values are solely for a thermal performance comparison of one
Thermal Resistance
Thermal Performance Comparison
R
R
R
R
θJA
θJA
θJB
θJA
θJC
).
(1),(2)
(2),(3)
(1),
(5)
(4)
T
J
=
R
θJA
.
P
[°C/W]
6.0
1.0
20
52
J
), and thermal
Figure 25. Thermal Land Pattern for Direct Thermal
12.2 mm x 6.9 mm Exposed Pad
Attachment According to JESD51-5
16.0 mm x 11.0 mm Body
20 Terminal HSOP-EP
Note For package dimensions, refer to
the 33887 device data sheet.
1.27 mm Pitch
THERMAL ADDENDUM (REV 2.0)
33887DH
ADDITIONAL DOCUMENTATION
20-PIN HSOP-EP
98ASH70273A
DH SUFFIX
HSOP-EP
20-PIN
* All measurements
0.2
are in millimeters
Soldermast
openings
Thermal vias
connected to top
buried plane
1.0
0.2
1.0
33887
33