MC33887DHR2 Freescale Semiconductor, MC33887DHR2 Datasheet - Page 7

• Manufacturer Part Number: MC33887DHR2
• Description: IC H-BRIDGE 5A CURR FDBK 20-HSOP
• Manufacturer: Freescale Semiconductor

Specifications of MC33887DHR2

• Applications: DC Motor Controller, H Bridge
• Number Of Outputs: 1
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• For Use With: KIT33887PNBEVB - KIT EVAL 33887 5A H-BRIDGE PQFNKIT33887DWBEVB - KIT EVAL 33887 5A H-BRIDGE SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -

Analog Integrated Circuit Device Data
Freescale Semiconductor
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Supply Voltage
Input Voltage
FS Status Output
Continuous Current
DH Suffix HSOP ESD Voltage
VW Suffix HSOP, SOICW-EP, and PQFN ESD Voltage
Storage Temperature
Peak Package Reflow Temperature During Reflow
Operating Temperature
1
2
3
4
5
6
7
8.
Human Body Model
Machine Model
Human Body Model
Machine Model
Ambient
Junction
Each Pin to AGND
Each Pin to PGND
Each Pin to V+
Each I/O to All Other I/Os
Performance at voltages greater than 28V is degraded.See
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
Exceeding the input voltage on IN1, IN2, EN, D1, or
Exceeding the pull-up resistor voltage on the open Drain
Continuous current capability so long as junction temperature is ≤ 150
ESD1 testing is performed in accordance with the Human Body Model (C
accordance with the Machine Model (C
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
(2)
(1)
(3)
(4)
(6)
Rating
(5)
ELECTRICAL CHARACTERISTICS
ZAP
= 200 pF, R
(7)
,
(8)
MAXIMUM RATINGS
(5)
D2
ZAP
may cause a malfunction or permanent damage to the device.
FS
°
Electrical Performance Curves on page 18
= 0 Ω).
pin may cause permanent damage to the device.
C can be tolerated as long as duration does not exceed 30 seconds
Symbol
°
V
V
V
V
V
V
V
T
C.
T
I
V
V
OUT
ESD1
ESD1
ESD1
ESD1
ESD2
ESD1
ESD2
PPRT
V+
T
STG
T
ZAP
FS
IN
A
J
= 100 pF, R
ZAP
= 1500 Ω), ESD2 testing is performed in
- 0.3 to 7.0
-0.3 to 7.0
- 65 to 150
- 40 to 125
- 40 to 150
ELECTRICAL CHARACTERISTICS
-0.3 to 40
Note 8.
±1000
±1500
±2000
±2000
± 2000
Value
± 200
±200
5.0
and 19 for typical performance.
MAXIMUM RATINGS
Unit
°C
°C
°C
V
V
V
A
V
V
33887
7