MC33887DHR2 Freescale Semiconductor, MC33887DHR2 Datasheet - Page 8

• Manufacturer Part Number: MC33887DHR2
• Description: IC H-BRIDGE 5A CURR FDBK 20-HSOP
• Manufacturer: Freescale Semiconductor

Specifications of MC33887DHR2

• Applications: DC Motor Controller, H Bridge
• Number Of Outputs: 1
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-HSOP
• For Use With: KIT33887PNBEVB - KIT EVAL 33887 5A H-BRIDGE PQFNKIT33887DWBEVB - KIT EVAL 33887 5A H-BRIDGE SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -

8
33887
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS
Notes
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(14)
Junction-to-Case (Exposed Pad)
10
11
12
13
14
15
9
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die
temperature represents ~ 16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the R
less than 5.0 °C/W for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
Rating
(15)
(13)
(9)
,
(10)
Symbol
R
R
R
R
,
θ
(11)
θ
θ
θ
JMA
JB
JA
JC
,
(12)
Analog Integrated Circuit Device Data
Value
~ 0.8
~7.0
~8.0
~9.0
~1.2
~2.0
~ 41
~ 50
~ 62
~ 18
~ 21
~ 23
Freescale Semiconductor
θ
JB
(junction-to-PC board)
θ
JC
-total must be
°C/W
°C/W
°C/W
°C/W
Unit