NE1617ADS,112 NXP Semiconductors, NE1617ADS,112 Datasheet
NE1617ADS,112
Specifications of NE1617ADS,112
NE1617ADS
NE1617ADS
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NE1617ADS,112 Summary of contents
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NE1617A Temperature monitor for microprocessor systems Rev. 04 — 30 July 2009 1. General description The NE1617A is an accurate two-channel temperature monitor. It measures the temperature of itself and the temperature of a remote sensor. The remote sensor is ...
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... NXP Semiconductors I ESD protection exceeds 2000 V HBM per JESD22-A114, 250 V MM per JESD22-A115, and 1000 V CDM per JESD22-C101 I Latch-up testing is done to JEDEC standard JESD78, which exceeds 100 mA I Small 16-lead SSOP (QSOP) package 3. Applications I Desktop computers I Notebook computers I Smart battery packs ...
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... NXP Semiconductors 5. Block diagram NE1617A LOCAL CONTROL TEMP LOGIC SENSOR D+ ANALOG A-to-D MUX CONVERTER D ADD1 ADD0 ALERT V GND GND DD Fig 1. Block diagram of NE1617A NE1617A_4 Product data sheet Temperature monitor for microprocessor systems STBY ONE-SHOT CONFIGURATION REGISTER CONVERSION RATE LOCAL HIGH TEMP ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 2. Symbol TEST1 TEST5 ADD1 GND TEST9 ADD0 ALERT SDATA TEST13 SCLK STBY TEST16 [1] These pins should either float or be tied to ground. [2] V pin should be decoupled by a 0.1 F capacitor. DD NE1617A_4 Product data sheet ...
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... NXP Semiconductors 7. Functional description The NE1617A contains an integrating A-to-D converter, an analog multiplexer, a status register, digital data registers, SMBus interface, associated control logic and a local temperature sensor or channel (refer to remote diode-type sensor or channel should be connected to the D+ and D pins properly. Temperature measurements or conversions are either automatically and periodically activated when the device is in free-running mode (both STBY pin = HIGH, and the confi ...
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... NXP Semiconductors than 3300 pF) connected between D+ and D is recommended. Capacitance higher than 3300 pF will introduce measurement error due to the rise time of the switched current source. 7.2 No calibration is required As mentioned ratio to measure the forward voltage of the diode (V the diode saturation current (a heavily process and temperature dependent variable), and results in the forward voltage being proportional to absolute temperature ...
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... NXP Semiconductors Table 3. n.c. = not connected [1] ADD0 [1] Any pull-up/pull-down resistor used to connect to GND or V 8.3 Registers The device contains more than 9 registers. They are used to store the data of device set-up and operation results. Depending on the bus communication (either read or write operations), each register may be called by different names because each register may have different sub-addresses or commands for read and write operations. For example, the confi ...
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... NXP Semiconductors 8.3.1 Low power standby modes Upon POR, the device is reset to its normal free-running auto-conversion operation mode. The device can be put into standby mode by either using hardware control (connect the STBY pin to LOW for hardware standby mode) or using software control (set bit 6 of the confi ...
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... NXP Semiconductors Table 6. Temperature ( C) +127 +126 +100 +50 + 8.3.4 Conversion rate register The conversion rate register is used to store programmable conversion data, which defines the time interval between conversions in standard free-running auto-convert mode. Table 7 the register are used and other bits are reserved for future use. This register can be written to and read back over the SMBus using commands of the registers named WCR and RCR, respectively ...
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... NXP Semiconductors commands of registers named WIHL, WILL, WEHL, WELL, RIHL, RILL, REHL, RELL, accordingly. The POR default values are +127 C (0111 1111) for the HIGH limit and 55 C (1100 1001) for the LOW limit. 8.3.6 One-shot command The one-shot command is not actually a data register as such and a write operation to it will initiate an ADC conversion ...
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... NXP Semiconductors the Alert Response byte from the Alert Response Address, which is a special slave address to the SMBus. The ALERT output cannot be reset by reading the device status register. The device was designed to accommodate the Alert interrupt detection capability of the SMBus. identify the slave device which has caused the Alert interrupt. The 7-bit Alert response slave address is 0001 100 and the Alert response byte refl ...
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... NXP Semiconductors 8.6 SMBus interface The device can communicate over a standard 2-wire serial interface System Management Bus (SMBus) using the device pins SCLK and SDATA. The device employs four standard SMBus protocols: write byte, read byte, send byte and receive byte. Data formats of those protocols are shown in • ...
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... NXP Semiconductors 9. Application design-in information remote sensor 2N3904 (NPN), 2N3906 (PNP) or similar stand-alone ASIC or processor thermal diode (1) Typical value, placed close to temperature sensor. Fig 4. 9.1 How do D+, D work? The NE1617A forces two well-controlled current sources of about 10 A and 100 A measures the remote diode V microprocessor is typically used, or the discrete diode-connected transistor 2N3904 or 2N3906 ...
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... NXP Semiconductors 10. Limiting values Table 11. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter amb T j(max) T stg NE1617A_4 Product data sheet Temperature monitor for microprocessor systems Limiting values Conditions supply voltage V to GND DD input voltage D+, ADD0, ADD1 D to GND ...
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... NXP Semiconductors 11. Characteristics Table 12. Characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter T temperature resolution res T local temperature accuracy acc(loc) T remote temperature accuracy acc(rem) V undervoltage lockout threshold th(UVLO) [1] voltage V power-on reset threshold th(POR) voltage I average supply current DD(AV) I standby supply current ...
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... NXP Semiconductors Table 13. Characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter ADC and power supply T temperature resolution res T local temperature accuracy acc(loc) T remote temperature acc(rem) [3] accuracy V supply voltage DD t conversion time conv E conversion rate error f(conv) SMBus interface V HIGH-level input voltage ...
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... NXP Semiconductors Table 14. SMBus interface dynamic characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL I logic output LOW sink current OL I HIGH-level input current IH I LOW-level input current IL C input capacitance i f SCLK operating frequency ...
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... NXP Semiconductors 11.1 Typical performance curves 20 temp. error ( GND leakage resistance (M ) Fig 6. Temperature error versus printed-circuit board leakage resistance 6 temp. error ( 100 mV and AC-coupled to D and Fig 8. Temperature error versus differential mode noise frequency NE1617A_4 Product data sheet Temperature monitor for microprocessor systems ...
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... NXP Semiconductors 100 I DD(stb Fig 10. Standby supply current versus clock frequency 3 temperature Fig 12. Response to thermal shock immersed in +115 C fluorinert bath NE1617A_4 Product data sheet Temperature monitor for microprocessor systems 002aad517 130 110 (kHz) SCLK Fig 11. Operating supply current versus conversion 150 ...
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... NXP Semiconductors 12. Package outline SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.25 1.55 mm 1.73 0.25 0.10 1.40 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 14. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Mounting 14.1 Printed-circuit board layout consideration Because the NE1617A is used to measure a very small voltage in the range of microvolts from the remote sensor, care must be taken to minimize noise induced at the sensor inputs, especially in the computer motherboard noisy environment ...
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... NXP Semiconductors could create a ground loop (refer to cable. Also, cold soldered joints and damaged cable could introduce series resistance and result in measurement error. For instance change of temperature of about 0.5 C. GND D+ D GND Fig 15. PCB layout for D+ and D 15. Abbreviations Table 17. ...
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... Revision history Document ID Release date NE1617A_4 20090730 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 2 rd – – ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Remote diode selection . . . . . . . . . . . . . . . . . . 5 7.2 No calibration is required . . . . . . . . . . . . . . . . . 6 7.3 Address logic . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Temperature monitor with SMBus serial interface ...