SE98TK,118 NXP Semiconductors, SE98TK,118 Datasheet
SE98TK,118
Specifications of SE98TK,118
935281692118
SE98TK-T
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SE98TK,118 Summary of contents
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... DDR memory module temp sensor, 3.3 V Rev. 04 — 2 February 2009 1. General description The NXP Semiconductors SE98 measures temperature from +125 C communicating via the I Module (DIMM) measuring the DRAM temperature in accordance with the new JEDEC (JC-42.4) Mobile Platform Memory Module Thermal Sensor Component specification. ...
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... NXP Semiconductors 2. Features 2.1 General features I JEDEC (JC-42.4) SO-DIMM temperature sensor I Optimized for voltage range Shutdown/Standby current (typ.) and 15 A (max.) I 2-wire interface SMBus ALERT and TIMEOUT (programmable) I Available packages: TSSOP8 and HVSON8 2.2 Temperature sensor features I Temperature-to-Digital converter I Operating current: 200 A (typ.) and 250 A (max.) I Programmable hysteresis threshold ...
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... NXP Semiconductors 5. Block diagram Fig 1. SE98_4 Product data sheet SE98 REGISTERS CRITICAL TEMPERATURE LIMIT UPPER TEMPERATURE LIMIT LOCK PROTECT LOWER TEMPERATURE LIMIT HYSTERESIS THRESHOLD MANUFACTURER ID DEVICE ID DEVICE CAPABILITY REGISTER CONFIGURATION REGISTER EVENT OUTPUT COMPARATOR/INT MODE EVENT OUTPUT POLARITY ENABLE/DISABLE EVENT OUTPUT ...
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... SS Fig 2. 6.2 Pin description Table 2. Symbol [ SDA SCL EVENT V DD [1] In general, application the A0 pin would not damage the pin, but NXP Semiconductors does not guarantee the overvoltage for this pin. SE98_4 Product data sheet EVENT SE98PW 3 6 SCL 4 5 SDA 002aab806 Pin confi ...
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... NXP Semiconductors 7. Functional description 7.1 Serial bus interface The SE98 uses the 2-wire serial bus (I controller. The serial bus consists of a clock (SCL) and data (SDA) signals. The device can operate on either the I Standard-mode is defined to have bus speeds from 100 kHz, I from 400 kHz, and the SMBus is from 10 kHz to 100 kHz ...
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... NXP Semiconductors 7.3 EVENT output condition The EVENT output indicates conditions such as the temperature crossing a predefined boundary. The EVENT modes are very configurable and selected using the configuration register (CONFIG). The interrupt mode or comparator mode is selected using CONFIG[0], using either TCRIT/UPPER/LOWER or TCRIT only temperature bands (CONFIG[2]) as modifi ...
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... NXP Semiconductors temperature ( C) critical Upper Boundary Alarm Lower Boundary Alarm EVENT in Comparator mode EVENT in Interrupt mode software interrupt clear EVENT in ‘Critical Temp only’ mode Refer to Table 3 for figure note information. Fig 5. EVENT output condition Table 3. EVENT output condition Figure EVENT output boundary ...
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... NXP Semiconductors 7.3.2 EVENT thresholds 7.3.2.1 Alarm window The device provides a comparison window with an UPPER trip point and a LOWER trip point, programmed through the Upper Boundary Alarm Trip register (02h), and Lower Boundary Alarm Trip register (03h). The Upper Boundary Alarm Trip register holds the upper temperature trip point, while the Lower Boundary Alarm Trip register holds the lower temperature trip point as modifi ...
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... NXP Semiconductors – Competitor devices: Compares the alarm limit with temperature register at any time, so they get the EVENT output immediately when new T are set at the same time. – Work-around: Wait at least 125 ms before enabling EVENT output. Intel will change Nehalem BIOS so that T is enabled and Event value is checked ...
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... NXP Semiconductors – Competitor devices: If the EVENT output is not cleared before or when the temperature is in the critical temperature threshold, EVENT will remain asserted after the temperature drops below the critical temperature until a Clear EVENT command. – Work-around: Always clear the EVENT output before temperature exceeds the critical temperature. – ...
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... NXP Semiconductors Table 4. Register 01h 02h 03h 04h 22h 7.7 SMBus time-out The SE98 supports the SMBus time-out feature. If the host holds SCL LOW between 25 ms and 35 ms, the SE98 would reset its internal state machine to the bus idle state to prevent the system bus hang-up. This feature is turned on by default. The SMBus time-out is disabled by writing a logic 1 to bit 7 of register 22h ...
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... NXP Semiconductors 7.9 SMBus/I The data registers in this device are selected by the Pointer register. At power-up, the Pointer register is set to ‘00’, the location for the Capability register. The Pointer register latches the last location it was set to. Each data register falls into one of three types of user accessibility: • ...
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... NXP Semiconductors SCL SDA S START device address and write by host SCL D15 D14 D13 D12 SDA by host most significant byte data A = ACK = Acknowledge bit Write bit = Read bit = 1. 2 Fig 8. SMBus/I C-bus write to the Pointer register followed by a write data word ...
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... NXP Semiconductors SCL SDA S START device address and read by host SCL D15 D14 D13 D12 SDA returned most significant byte data A = ACK = Acknowledge bit Not Acknowledge bit Write bit = Read bit = 1. 2 Fig 10. SMBus/I C-bus word read from register with a pre-set pointer 7 ...
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... NXP Semiconductors 8. Register descriptions 8.1 Register overview This section describes all the registers used in the SE98. The registers are used for latching the temperature reading, storing the low and high temperature limits, configuring, the hysteresis threshold and the ADC, as well as reporting status. The device uses the Pointer register to access these registers ...
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... NXP Semiconductors 8.2 Capability register (00h, 16-bit read-only) Table 6. Capability register (address 00h) bit allocation Bit 15 Symbol Reset 0 Access R Bit 7 Symbol RFU[2:0] Reset 0 Access R Table 7. Bit 15:5 4 SE98_4 Product data sheet RFU[10: TRES[1: Capability register (address 00h) bit description Symbol Description RFU Reserved for future use ...
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... NXP Semiconductors 8.3 Configuration register (01h, 16-bit read/write) Table 8. Configuration register (address 01h) bit allocation Bit 15 Symbol Default 0 Access R Bit 7 Symbol CTLB AWLB Default 0 Access R/W R/W Table 9. Bit 15:11 10:9 8 SE98_4 Product data sheet RFU CEVNT ESTAT R/W R/W Confi ...
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... NXP Semiconductors Table 9. Bit SE98_4 Product data sheet Configuration register (address 01h) bit description Symbol Description CTLB Critical Trip Lock bit. 0 — Critical Alarm Trip register is not locked and can be altered (default). 1 — Critical Alarm Trip register settings cannot be altered. ...
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... NXP Semiconductors Table 9. Bit 1 0 Table 10. Hysteresis enable Action Below Alarm Window Bit (bit 13) Temperature Threshold slope temperature sets falling T trip(l) clears rising T trip(l) Above Critical Trip Above Alarm Window Below Alarm Window Fig 11. Hysteresis: how it works SE98_4 Product data sheet Confi ...
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... NXP Semiconductors 8.4 Temperature format The 16-bit value used in the following Trip Point Set and Temperature Read-Back registers is 2’s complement with the Least Significant Bit (LSB) equal to 0.0625 C. For example: • A value of 019Ch will represent 25.75 C • A value of 07C0h will represent 124 C • ...
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... NXP Semiconductors 8.5 Temperature Trip Point registers 8.5.1 Upper Boundary Alarm Trip register (16-bit read/write) The value is the upper threshold temperature value for Alarm mode. The data format is 2’s complement with bit 2 = 0.25 C. ‘RFU’ bits will always report zero. Interrupts will respond to the presently programmed boundary values ...
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... NXP Semiconductors 8.5.2 Lower Boundary Alarm Trip register (16-bit read/write) The value is the lower threshold temperature value for Alarm mode. The data format is 2’s complement with bit 2 = 0.25 C. RFU bits will always report zero. Interrupts will respond to the presently programmed boundary values. If boundary values are being altered in-system advised to turn off interrupts until a known state can be obtained to avoid superfl ...
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... Symbol Reset Access Table 19. Bit 11:1 0 8.7 Manufacturer’s ID register (16-bit read-only) The manufacture’s ID matches that assigned to NXP Semiconductors PCI-SIG (1131h), and is intended for use to identify the manufacturer of the device. Table 20. Bit Symbol Reset Access Bit Symbol Reset Access SE98_4 ...
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... NXP Semiconductors 8.8 Device ID register The device ID and device revision are A1h and 00h, respectively. Table 21. Bit Symbol Reset Access Bit Symbol Reset Access 8.9 SMBus register Table 22. Bit Symbol Reset Access Bit Symbol Reset Access Table 23. Bit 15:8 7 6:1 0 SE98_4 ...
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... NXP Semiconductors 9. Application design-in information In a typical application, the SE98 behaves as a slave device and interfaces to the master (or host) via the SCL and SDA lines. The host monitors the EVENT output pin, which is asserted when the temperature reading exceeds the programmed values in the alarm registers. The A0, A1 and A2 pins are directly connected to the shared SPD’ ...
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... Symbol sink V esd T j(max) T stg [1] In general, application the A0 pin would not damage the pin, but NXP Semiconductors does not guarantee the overvoltage for this pin. SE98_4 Product data sheet is the formula to calculate the effect of self-heating j OL1 T j amb = ambient temperature ...
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... NXP Semiconductors 11. Characteristics Table 25. Characteristics +125 C; unless otherwise specified. DD amb Symbol Parameter T temperature limit accuracy lim(acc) T temperature resolution res I average supply current DD(AV) I standby supply current DD(stb) T conversion period conv E conversion rate error f(conv) I leakage current L V supply voltage DD Table 26 ...
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... NXP Semiconductors 300 I DD(AV 3 3.3 V 200 3.6 V 100 Fig 14. Supply current versus temperature 15.0 I OL(sink)EVENT (mA) 3.3 V 3.6 V 10.0 5 Fig 16. EVENT sink current at 0.4 V versus temperature Sample of 25 devices at V Fig 18. Temperature Error versus temperature SE98_4 Product data sheet 002aac157 I DD(stb) ...
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... NXP Semiconductors Table 27. SMBus AC characteristics +120 C; unless otherwise specified. These specifications are guaranteed by design. DD amb The AC specifications fully meet or exceed SMBus 2.0 specifications, but allow the bus to interface with the I to 400 kHz. Symbol Parameter f SCL clock frequency ...
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... NXP Semiconductors 12. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 0. terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0 0.2 0.00 0.2 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 22. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Abbreviations Table 30. Acronym ADC ARA CDM CMOS DIMM DRAM HBM 2 I C-bus LSB MM MSB ...
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... NXP Semiconductors 15. Revision history Table 31. Revision history Document ID Release date SE98_4 20090202 • Modifications: Changed data sheet descriptive title from “SO-DIMM SMBus/I “DDR memory module temp sensor, 3.3 V” • Section 1 “General +125 C” • Section 2.2 “Temperature sensor to “ +125 C” ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 General features . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Temperature sensor features . . . . . . . . . . . . . . 2 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5 7.2 Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.3 EVENT output condition ...
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... NXP Semiconductors SE98_4 Product data sheet DDR memory module temp sensor, 3.3 V Rev. 04 — 2 February 2009 SE98 © NXP B.V. 2009. All rights reserved ...
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... NXP Semiconductors SE98_4 Product data sheet DDR memory module temp sensor, 3.3 V Rev. 04 — 2 February 2009 SE98 © NXP B.V. 2009. All rights reserved ...