BD9775FV-E2 Rohm Semiconductor, BD9775FV-E2 Datasheet - Page 26

• Manufacturer Part Number: BD9775FV-E2
• Description: IC REG SW STEP DOWN HE 28-SSOP
• Manufacturer: Rohm Semiconductor
• Type: Step-Down (Buck)r

Specifications of BD9775FV-E2

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Current - Output: 400mA
• Frequency - Switching: 100kHz
• Voltage - Input: 6 ~ 30 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP
• Power - Output: 640mW
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BD9775FV-E2TR

● Operation Notes (BD9775FV)
1) Absolute maximum ratings
2) GND potential
3) Thermal design
4) Inter-pin shorts and mounting errors
5) Operation in a strong electromagnetic field
6) Thermal shutdown circuit (TSD circuit)
7) Testing on application boards
8) Common impedance
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to prevent runaway
thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of the thermal
shutdown circuit is assumed.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and use similar caution when transporting
or storing the IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process.
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC deterioration
or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered.
A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute maximum ratings
may be exceeded is anticipated.
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry a voltage lower
than or equal to the GND pin, including during actual transient phenomena.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC.
Shorts between output pins or between output pins and the power supply and GND pin caused by the presence of a foreign object may result in
damage to the IC.
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as possible
(by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance).
VREGA
VREGA
VCC
DTC1(8),DTC2(9)
OUT1(25),OUT2H(23),VREGB(24)
VCC
SCP(19)
PVCC1(26),PVCC2(22)
VREF
VREF
VREF
VREF
DTC1,2
DTC1,2
VCC
VCC
VREGB
SCP
VREGB
VCC
OUT1,2H
VCC
PVCC1，2
OUTH1，2H
PVCC1,2
SCP
VREGA
VREGA
OUT2L(17),VREGA(18)
CTL1(12),CTL2(13)
Fig.8
26/29
VCC
VCC
VCC
VCC
VS1(28),VS2(20),CL1(27),CL2(21)
CTL1，2
CTL1,2
VREGA
OUT2L
OUT2L
VREGA
VCC
VCC
～ ～
VREF
VREF
CL1，2
VS1，2
CL1,2
VS1,2
SYNC(15)
VREF(7)
VCC
VC
VCC
VCC
SYNC
SYNC
VREF
VREF