MT36VDDF25672Y-335D2 Micron Technology Inc, MT36VDDF25672Y-335D2 Datasheet - Page 26

• Manufacturer Part Number: MT36VDDF25672Y-335D2
• Description: MODULE SDRAM DDR 2GB 184DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT36VDDF25672Y-335D2

• Memory Type: DDR SDRAM
• Memory Size: 2GB
• Speed: 333MT/s
• Package / Case: 184-DIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 184RDIMM
• Device Core Size: 72b
• Organization: 256Mx72
• Total Density: 2GByte
• Chip Density: 512Mb
• Maximum Clock Rate: 333MHz
• Operating Supply Voltage (typ): 2.5V
• Operating Current: 3.24A
• Number Of Elements: 36
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 184
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 19: Register Timing Requirements and Switching Characteristics
Note 1
NOTE:
pdf: 09005aef80772fd2, source: 09005aef8075ebf6
DDF36C128_256x72G.fm - Rev. D 9/04 EN
REGISTER
or JESD82-4)
1. The timing and switching specifications for the register listed above are critical for proper operation of the DDR SDRAM
2. Data inputs must be low a minimum time of t
3. Data and clock inputs must be held at valid levels (not floating) a minimum time of t
4. For data signal input slew rate
5. For data signal input slew rate
6. CK, CK# signals input slew rate
by JESD82-3
(bit pattern
Registered DIMMs. These are meant to be a subset of the parameters for the specific device used on the module.
Detailed information for this register is available in JEDEC Standard JESD82-4.
LOW.
SSTL
SYMBOL PARAMERTER
f
t
clock
t
t
t
inact
t
t
t
PHL
act
pd
su
w
h
Clock Frequency
Clock to Output Time
Reset To Output Time
Pulse Duration
Differential Inputs Active Time
Differential Inputs Inactive Time
Setup Time, Fast Slew Rate
Setup Time, Slow Slew Rate
Hold Time, Fast Slew Rate
Hold Time, Slow Slew Rate
1 V/ns.
0.5 V/ns and
1V/ns.30
act
1V/ns.
max, after RESET# is taken HIGH.
26
30pF to GND and
CK, CK# HIGH or
HIGH, CK# LOW
HIGH, CK# LOW
50 Ohms to V
Data Before CK
Data After CK
CONDITION
LOW
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TT
1GB, 2GB (x72, ECC, DR)
V
0°C
DD
MIN
0.75
0.75
1.1
2.5
0.9
0.9
184-PIN DDR RDIMM
-
-
-
-
= +2.5V ±0.2V
inact
T
A
max, after RESET# is taken
+70°C
MAX
200
©2004 Micron Technology, Inc. All rights reserved.
2.8
22
22
5
-
-
-
-
-
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
NOTES
4, 6
5, 6
4, 6
5, 6
2
3