PIC16F627-04/SO Microchip Technology, PIC16F627-04/SO Datasheet - Page 132

• Manufacturer Part Number: PIC16F627-04/SO
• Description: IC MCU FLASH 1KX14 COMP 18SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F627-04/SO

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 4MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Controller Family/series: PIC16F
• No. Of I/o's: 16
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 224Byte
• Cpu Speed: 4MHz
• No. Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SCI, USART
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Data Converters: -
• Lead Free Status / Rohs Status: Details

PIC16F62X
17.1
DS40300C-page 130
PIC16LF62X-04
PIC16F62X-04
PIC16F62X-20
D001
D001
D002
D003
D004
D005
D010
D013
D010
D013
D014
Legend: Rows with standard voltage device data only are shaded for improved readability.
Note 1: This is the limit to which V
Param
(Commercial, Industrial, Extended)
(Commercial, Industrial)
No.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with
4: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be added to the
5: For RC osc configuration, current through R
6: Commercial temperature only.
*
†
DC Characteristics: PIC16F62X-04 (Commercial, Industrial, Extended)
V
V
S
switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
sumption.
the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
base I
formula Ir = V
Sym
not tested.
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C, unless otherwise stated. These parameters are for design guidance only and are
V
V
I
POR
VDD
BOD
DD
DD
DR
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
MCLR = V
DD
Supply Voltage
RAM Data Retention
Voltage
V
to ensure Power-on Reset
V
to ensure Power-on Reset
Brown-out Detect Voltage
Supply Current
or I
DD
DD
Characteristic/Device
PD
Start Voltage
Rise Rate
DD
DD
measurement.
(1)
/2R
; WDT enabled/disabled as specified.
EXT
(mA) with R
(2), (5)
DD
PIC16LF62X
PIC16LF62X
PIC16F62X-20 (Commercial, Industrial, Extended)
PIC16LF62X-04 (Commercial, Industrial)
PIC16F62X
PIC16F62X
can be lowered in SLEEP mode without losing RAM data.
DD
measurements in active Operation mode are:
EXT
in kΩ.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
EXT
0.05
3.65
3.65
Min
Preliminary
3.0
2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
is not included. The current through the resistor can be estimated by the
Typ†
0.30
1.10
3.80
0.60
1.10
3.80
V
1.5
4.0
4.0
4.0
20
20
—
—
—
—
—
—
SS
Max
4.35
5.5
5.5
4.4
0.6
2.0
7.0
6.0
2.0
0.7
2.0
7.0
6.0
2.0
—
—
—
30
30
-40°C ≤ Ta ≤ +85°C for industrial and
-40°C ≤ Ta ≤ +85°C for industrial and
-40°C ≤ Ta ≤ +125°C for extended
0°C ≤ Ta ≤ +70°C for commercial
0°C ≤ Ta ≤ +70°C for commercial and
DD
Units
V/ms
or V
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
V
V
V
V
V
V
SS
DD
.
 2003 Microchip Technology Inc.
,
Device in SLEEP mode*
See section on Power-on Reset
for details
See section on Power-on Reset
for details*
BODEN configuration bit is set
BODEN configuration bit is set,
Extended
Fosc = 4.0 MHz, V
F
Fosc = 20.0 MHz, V
Fosc = 20.0 MHz, V
F
F
Fosc = 4.0 MHz, V
Fosc = 4.0 MHz, V
F
F
F
F
OSC
OSC
OSC
OSC
OSC
OSC
OSC
= 4.0 MHz, V
= 10.0 MHz, V
= 32 kHz, V
= 20.0 MHz, V
= 20.0 MHz, V
= 10.0 MHz, V
= 32 kHz, V
Conditions
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
= 2.0
= 3.0*
= 2.0
= 3.0
= 5.5*
= 5.5*
= 5.5
= 4.5*
= 3.0
= 5.5
= 4.5*
= 3.0*
(5)
(6)
(6)