PIC32MX460F512L-80I/PT Microchip Technology, PIC32MX460F512L-80I/PT Datasheet - Page 18

IC PIC MCU FLASH 512K 100-TQFP

PIC32MX460F512L-80I/PT

Manufacturer Part Number
PIC32MX460F512L-80I/PT
Description
IC PIC MCU FLASH 512K 100-TQFP
Manufacturer
Microchip Technology
Series
PIC® 32MXr

Specifications of PIC32MX460F512L-80I/PT

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-TFQFP
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC32MX4xx
Core
MIPS
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
I2C , SPI , UART
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
85
Number Of Timers
5 x 16 bit, 1 x 32 bit
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Controller Family/series
PIC32
No. Of I/o's
85
Ram Memory Size
32KB
Cpu Speed
80MHz
No. Of Timers
6
Embedded Interface Type
EUART, I2C, PSP, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKDM320003 - BOARD DEMO USB PIC32 OTGAC244006 - KIT MPLAB REAL ICE TRACEAC164333 - MODULE SKT FOR PM3 100QFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC32MX460F512L-80I/PT
Manufacturer:
VISHAY
Quantity:
3 200
Part Number:
PIC32MX460F512L-80I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC32MX460F512L-80I/PT
0
PIC32MX
9.0
Before a device can be programmed, it must be
erased. The erase operation writes all ‘1s’ to the Flash
memory and prepares it to program a new set of data.
Once a device is erased, it can be verified by perform-
ing a “Blank Check” operation. See 9.1 “Blank Check”
for more information.
The procedure for erasing program memory (Program,
Boot, and Configuration memory) consists of selecting
the MTAP and sending the MCHP_ERASE command.
The programmer then must wait for the erase operation
to complete by reading and verifying bits in the
MCHP_STATUS value. Figure 9-1 illustrates the process
for performing a Chip Erase.
FIGURE 9-1:
DS61145G-page 18
Note:
ERASING THE DEVICE
The Device ID memory locations are read-
only and cannot be erased. Therefore,
Chip Erase has no effect on these memory
locations.
statusVal = XferData (MCHP_STATUS)
No
SendCommand (MTAP_SW_MTAP)
SendCommand (MTAP_COMMAND)
Put MTAP in Command Mode
Issue Chip Erase Command
XferData (MCHP_ERASE)
Read Erase Status
Select MTAP
ERASE DEVICE
CFGRDY = 1
FCBUSY = 0
Done
Yes
The following steps are required to erase a target
device:
1.
2.
3.
4.
5.
9.1
The term “Blank Check” implies verifying that the
device has been successfully erased and has no
programmed memory locations. A blank or erased
memory location always reads as ‘1’.
The device Configuration registers are ignored by the
Blank Check. Additionally, all unimplemented memory
space should be ignored from the Blank Check.
Note:
SendCommand (MTAP_SW_MTAP).
SendCommand (MTAP_COMMAND).
XferData (MCHP_ERASE).
statusVal = XferData (MCHP_STATUS).
If CFGRDY (statusVal<3>) is not ‘1’ and
FCBUSY (statusVal<4>) is not ‘0’, GOTO to
step 4.
Blank Check
The Chip Erase operation is a self-timed
operation. If the FCBUSY and CFGRDY
bits do not become properly set within the
specified Chip Erase time, the sequence
may have been executed wrong or the
device is damaged.
© 2010 Microchip Technology Inc.

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