PIC32MX460F512L-80I/PT Microchip Technology, PIC32MX460F512L-80I/PT Datasheet - Page 4

• Manufacturer Part Number: PIC32MX460F512L-80I/PT
• Description: IC PIC MCU FLASH 512K 100-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX460F512L-80I/PT

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-TFQFP
• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC32MX4xx
• Core: MIPS
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C , SPI , UART
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 5 x 16 bit, 1 x 32 bit
• Operating Supply Voltage: 2.3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Controller Family/series: PIC32
• No. Of I/o's: 85
• Ram Memory Size: 32KB
• Cpu Speed: 80MHz
• No. Of Timers: 6
• Embedded Interface Type: EUART, I2C, PSP, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1000 - PIC32 BREAKOUT BOARDAC244003 - TEST BD MPLAB REAL ICE LOOPBACKDM320003 - BOARD DEMO USB PIC32 OTGAC244006 - KIT MPLAB REAL ICE TRACEAC164333 - MODULE SKT FOR PM3 100QFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC32MX
4.0
The PIC32MX family provides two possible physical
interfaces for connecting to and programming the
memory contents (Figure 4-1). For all programming
interfaces, the target device must be properly powered
and all required signals must be connected.
FIGURE 4-1:
4.1
One possible interface is the 4-wire JTAG (IEEE
1149.1) port. Table 4-1 lists the required pin connec-
tions. This interface uses the following four communi-
cation lines to transfer data to and from the PIC32MX
device being programmed:
• TCK – Test Clock Input
• TMS – Test Mode Select Input
• TDI – Test Data Input
• TDO – Test Data Output
TABLE 4-1:
DS61145G-page 4
MCLR
ENVREG
V
V
V
TDI
TDO
TCK
TMS
Legend: I = Input
Note 1:
DD
SS
DDCORE
Pin Name
Programmer
and AV
and AV
Device
CONNECTING TO THE DEVICE
4-Wire Interface
All power supply and ground pins must be connected, including analog supplies (AV
(AV
SS
DD
(1)
SS
(1)
).
4-WIRE INTERFACE PINS
MCLR
N/A
V
V
N/A
TDI
TDO
TCK
TMS
Programmer
+ MCLR, V
DD
SS
Pin Name
PROGRAMMING
INTERFACES
2-Wire
ICSP™
4-Wire
JTAG
OR
DD
, V
SS
O = Output
Pin Type
PIC32
O
P
P
P
P
I
I
I
I
Programming Enable
Enable for On-Chip Voltage Regulator
Power Supply
Ground
Regulated Power Supply for Core
Test Data In
Test Data Out
Test Clock
Test Mode State
These signals are described in the following four sec-
tions. Refer to the specific device data sheet for the
connection of the signals to the chip pins.
4.1.1
TCK is the clock that controls the updating of the TAP
controller and the shifting of data through the Instruc-
tion or selected Data register(s). TCK is independent of
the processor clock with respect to both frequency and
phase.
4.1.2
TMS is the control signal for the TAP controller. This
signal is sampled on the rising edge of TCK.
4.1.3
TDI is the test data input to the Instruction or selected
Data register(s). This signal is sampled on the rising
edge of TCK for some TAP controller states.
4.1.4
TDO is the test data output from the Instruction or Data
register(s). This signal changes on the falling edge of
TCK. TDO is only driven when data is shifted out,
otherwise the TDO is tri-stated.
P = Power
TEST CLOCK INPUT (TCK)
TEST MODE SELECT INPUT (TMS)
TEST DATA INPUT (TDI)
TEST DATA OUTPUT (TDO)
Pin Description
© 2010 Microchip Technology Inc.
DD
) and ground