LPC2106FBD48/01,15 NXP Semiconductors, LPC2106FBD48/01,15 Datasheet - Page 37

• Manufacturer Part Number: LPC2106FBD48/01,15
• Description: IC ARM7 MCU FLASH 128K 48-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2106FBD48/01,15

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 48-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 32
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 64 KB
• Interface Type: I2C/SPI/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC2106-PL, DB-LQFP48-LPC2106
• Minimum Operating Temperature: - 40 C
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 60MHz
• Total Internal Ram Size: 64KB
• # I/os (max): 32
• Number Of Timers - General Purpose: 2
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.65/3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4297 - BOARD EVAL LPC21XX MCB2100622-1019 - BOARD FOR LPC2106 48-LQFP622-1008 - BOARD FOR LPC9103 10-HVSON622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-1756 - BOARD EVAL FOR LPC210X ARM MCU
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4367; 935286617151; LPC2106FBD48/01-S

NXP Semiconductors
Fig 14. Package outline SOT619-1 (HVQFN48)
LPC2104_2105_2106_7
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT619-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
12
1
0.30
0.18
b
e
13
48
IEC
- - -
0.2
c
D
7.1
6.9
(1)
5.25
4.95
D h
e 1
D h
D
MO-220
JEDEC
1/2
E
7.1
6.9
e
(1)
REFERENCES
0
Rev. 07 — 20 June 2008
5.25
4.95
b
E h
37
0.5
24
e
JEITA
scale
25
36
2.5
- - -
B
1/2
e
5.5
e 1
e
w
v
A
E
M
M
e 2
5.5
e 2
C
C
A
5 mm
B
0.5
0.3
L
LPC2104/2105/2106
A
0.1
v
Single-chip 32-bit microcontrollers
A 1
y 1 C
0.05
w
PROJECTION
EUROPEAN
0.05
detail X
y
0.1
y 1
X
C
y
© NXP B.V. 2008. All rights reserved.
ISSUE DATE
01-08-08
02-10-18
SOT619-1
c
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