MC9S12E256MFUE Freescale Semiconductor, MC9S12E256MFUE Datasheet - Page 117

• Manufacturer Part Number: MC9S12E256MFUE
• Description: IC MCU 256K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E256MFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 80-QFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 12
• Operating Supply Voltage: 0 V to 5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 60
• Ram Memory Size: 16KB
• Cpu Speed: 25MHz
• No. Of Timers: 3
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

is determined by the Flash security byte (0xFF0F). The backdoor key access sequence has no effect on the
program and erase protections defined in the Flash protection register.
It is not possible to unsecure the MCU in special single-chip mode by using the backdoor key access
sequence via the background debug mode (BDM).
2.6.2
The MCU can be unsecured in special single-chip mode by erasing the Flash module by the following
method :
After the CCIF flag sets to indicate that the mass operation has completed, reset the MCU into special
single-chip mode. The BDM secure ROM will verify that the Flash memory is erased and will assert the
UNSEC bit in the BDM status register. This BDM action will cause the MCU to override the Flash security
state and the MCU will be unsecured. All BDM commands will be enabled and the Flash security byte
may be programmed to the unsecure state by the following method:
2.7
2.7.1
On each reset, the Flash module executes a reset sequence to hold CPU activity while loading the
following registers from the Flash memory according to
2.7.2
If a reset occurs while any Flash command is in progress, that command will be immediately aborted. The
state of the word being programmed or the sector / block being erased is not guaranteed.
Freescale Semiconductor
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Reset the MCU into special single-chip mode, delay while the erase test is performed by the BDM
secure ROM, send BDM commands to disable protection in the Flash module, and execute a mass
erase command write sequence to erase the Flash memory.
Send BDM commands to execute a word program sequence to program the Flash security byte to
the unsecured state and reset the MCU.
FPROT — Flash Protection Register (see
FCTL — Flash Control Register (see
FSEC — Flash Security Register (see
Resets
Unsecuring the Flash Module in Special Single-Chip Mode using
BDM
Flash Reset Sequence
Reset While Flash Command Active
MC9S12E256 Data Sheet, Rev. 1.08
Section 2.3.2.9, “Flash Control Register
Section 2.3.2.2, “Flash Security Register
Section 2.3.2.5, “Flash Protection Register
Table
2-1:
Chapter 2 256 Kbyte Flash Module (FTS256K2V1)
(FCTL)”).
(FSEC)”).
(FPROT)”).
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