C8051F901-GU Silicon Laboratories Inc, C8051F901-GU Datasheet - Page 35

• Manufacturer Part Number: C8051F901-GU
• Description: IC MCU 8BIT 8KB FLASH 24QSOP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F9xxr

Specifications of C8051F901-GU

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 24-QSOP
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 16
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 15x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F9x
• Core: 8051
• Data Ram Size: 768 B
• Interface Type: UART
• Maximum Clock Frequency: 25 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 0.9 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F912DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Package: 24QSOP
• Device Core: 8051
• Family Name: C8051F90x
• Maximum Speed: 25 MHz
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1847-5

Notes:
General
1.
2.
Solder Mask Design
1.
Stencil Design
1.
2.
3.
Card Assembly
1.
2.
All dimensions shown are in millimeters (mm) unless otherwise noted.
This land pattern is based on the IPC-7351 guidelines.
All metal pads are to be non-solder mask defined (NMSD). Clearance between the solder mask and
the metal pad is to be 60 m minimum, all the way around the pad.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to
assure good solder paste release.
The stencil thickness should be 0.125 mm (5 mils).
The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
A No-Clean, Type 3 solder paste is recommended.
The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.
Dimension
C
E
X
Y
Figure 3.6. QSOP-24 Landing Diagram
Table 3.5. PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
MIN
C8051F91x-C8051F90x
0.635 BSC
MAX
5.30
0.40
1.60
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