MC705P6ACDWE Freescale Semiconductor, MC705P6ACDWE Datasheet - Page 94

IC MCU 176 BYTES RAM 28-SOIC

MC705P6ACDWE

Manufacturer Part Number
MC705P6ACDWE
Description
IC MCU 176 BYTES RAM 28-SOIC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC705P6ACDWE

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SIO
Peripherals
POR, WDT
Number Of I /o
21
Program Memory Size
4.5KB (4.5K x 8)
Program Memory Type
OTP
Ram Size
176 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
HC705P
Core
HC05
Data Bus Width
8 bit
Data Ram Size
176 B
Maximum Clock Frequency
2.1 MHz
Number Of Programmable I/os
21
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Mechanical Specifications
15.3 Small Outline Integrated Circuit Package (Case 751F)
94
-T-
28
1
28X
26X
0.010 (0.25)
D
G
-A-
M
MC68HC705P6A Advance Information Data Sheet, Rev. 2.1
T A
S
B
S
15
14
K
-B-
C
SEATING
PLANE
-T-
R
14X
X 45°
0.010 (0.25)
P
M
B
M
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
17.80
10.05
Freescale Semiconductor
MIN
7.40
2.35
0.35
0.41
0.23
0.13
0.25
1.27 BSC
18.05
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.29
0.75
0.701
0.292
0.093
0.014
0.016
0.009
0.005
0.395
0.010
MIN
0.050 BSC
INCHES
MAX
0.711
0.299
0.104
0.019
0.035
0.013
0.011
0.415
0.029